首页> 外国专利> EXPANDABLE BASE FILM, DICING FILM, SURFACE PROTECTIVE FILM FOR SEMICONDUCTOR, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

EXPANDABLE BASE FILM, DICING FILM, SURFACE PROTECTIVE FILM FOR SEMICONDUCTOR, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

机译:用于半导体的可扩展基膜,切丁膜,表面保护膜以及制造半导体装置的方法

摘要

PROBLEM TO BE SOLVED: To provide an expandable base film which is excellent in stress relaxation properties and is reduced in anisotropy of tensile elongation at break and anisotropy of tear strength.SOLUTION: The expandable base film contains: a polymer A containing 70-95 mol% of a constituent unit (X) derived from 4-methyl-1-pentene and 5-30 mol% of a constituent unit (Y) derived from a C2-C20 -olefin other than 4-methyl-1-pentene; and a polymer B containing the constituent unit (Y) as a main component. When the total amount of the polymer A and the polymer B is 100 pts.mass, the content of the polymer A is 20-90 pts.mass and the content of the polymer B is 10-80 pts.mass.
机译:解决的问题:提供一种具有良好的应力松弛性能并且减小了断裂时的拉伸伸长率的各向异性和撕裂强度的各向异性的可膨胀基膜。解决方案:该可膨胀基膜包含:包含70-95 mol的聚合物A衍生自4-甲基-1-戊烯的构成单元(X)的%和衍生自4-甲基-1-戊烯以外的C2-C20-烯烃的构成单元(Y)的5〜30摩尔%。以及以构成单元(Y)为主要成分的聚合物B。当聚合物A和聚合物B的总量为100pts。质量时,聚合物A的含量为20-90pts。质量,并且聚合物B的含量为10-80pts。质量。

著录项

  • 公开/公告号JP2015096580A

    专利类型

  • 公开/公告日2015-05-21

    原文格式PDF

  • 申请/专利权人 MITSUI CHEMICALS INC;

    申请/专利号JP20130237250

  • 发明设计人 UEKUSA TAKAYUKI;TAMO KATSUMASA;

    申请日2013-11-15

  • 分类号C08L23/02;C08J5/18;H01L21/301;H01L21/304;C09J7/02;B32B27;B32B27/32;C08L23/20;

  • 国家 JP

  • 入库时间 2022-08-21 15:34:30

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