Techniques are bottom filled leaving a gap , comprising the step of pulsing the stamp , increase the imprint of soft material on the substrate using a stamp

摘要

Method of forming a pattern on the flowable resist material on the substrate during the stamping wedges split process , the resist is not completely fill the space between the stamp bottom between the substrate and the wedge-shaped protrusion , all locations between and includes providing a very thin resist layer so as to leave a gap . Gap remains between the resist and the stamp surface extension . When the resist layer to be deposited slightly thicker than the target amount , just the gap between the resist and the tool is reduced . The presence of a continuous gap , and is secured so that the pressure is not accumulated under the stamp . Thus , the force on the projection is determined only by the pressure of the stamp upward is well controlled , the holes appropriately controlled size are formed . Gap , because it prevents from being completely pushed out from the resist any areas , prevent the region is not covered by the resist . Stamp is allowed to pulsation in contact with the substrate , can be repeatedly deforming the protrusion is recessed . As usual etching normal period is determined by the etching test to compare the degree to wipe the substrate material , scum layer is further than one pulsation several times pulsation . Method of forming a pattern on the flowable resist material on the substrate during the stamping wedges split process , the resist is not completely fill the space between the stamp bottom between the substrate and the wedge-shaped protrusion , all locations between and includes providing a very thin resist layer so as to leave a gap . Gap remains between the resist and the stamp extension surface . [ Selection Figure Figure 7