首页> 外国专利> TECHNIQUES FOR IMPROVED IMPRINTING OF SOFT MATERIAL ON SUBSTRATE USING STAMP INCLUDING UNDERFILLING TO LEAVE A GAP AND PULSING STAMP

TECHNIQUES FOR IMPROVED IMPRINTING OF SOFT MATERIAL ON SUBSTRATE USING STAMP INCLUDING UNDERFILLING TO LEAVE A GAP AND PULSING STAMP

机译:利用印记(包括未填满的间隙和脉冲印记)改进在基质上软质材料的印记技术

摘要

A method for imparting a pattern to a flowable resist material on a substrate entails providing a resist layer so thin that during a stamp wedging process, the resist never completely fills the space between the substrate and the bottom surface of a stamp between wedge protrusions, leaving gap everywhere therebetween. A gap remains between the resist and the extended surface of the stamp. If the resist layer as deposited is somewhat thicker than the targeted amount, it will simply result in a smaller gap between resist and tool. The presence of a continuous gap assures that no pressure builds under the stamp. Thus, the force on the protrusions is determined only by the pressure above the stamp and is well controlled, resulting in well-controlled hole sizes. The gap prevents resist from being pumped entirely out of any one region, and thus prevents any regions from being uncovered of resist. The stamp can be pulsed in its contact with the substrate, repeatedly deforming the indenting protrusions. Several pulses clears away any scum layer better than does a single press, as measured by an etch test comparison of the degree to which a normal etch for a normal duration etches away substrate material. A method for imparting a pattern to a flowable resist material on a substrate entails providing a resist layer so thin that during a stamp wedging process, the resist never completely fills the space between the substrate and the bottom surface of a stamp between wedge protrusions, leaving a gap everywhere therebetween. A gap remains between the resist and the extended surface of the stamp.
机译:一种用于向基板上的可流动抗蚀剂材料赋予图案的方法,需要提供如此薄的抗蚀剂层,以使得在压模楔入过程中,抗蚀剂永远不会完全填充基板和楔形突起之间的压模底面之间的空间,从而留下它们之间无处不在。在抗蚀剂和压模的延伸表面之间保持间隙。如果沉积的抗蚀剂层略厚于目标量,则只会导致抗蚀剂和工具之间的间隙变小。连续的间隙的存在确保了压模下没有压力。因此,作用在突起上的力仅由压模上方的压力确定,并且受到良好控制,从而可控制孔的大小。该间隙防止抗蚀剂被完全泵出任何一个区域,从而防止任何区域被抗蚀剂覆盖。压模可以在其与基板接触时被脉冲化,从而使压痕突起反复变形。几次脉冲比单次冲刷能更好地清除任何浮渣层,这是通过蚀刻测试比较的结果得出的,该测试比较了正常时间内正常蚀刻对基板材料的蚀刻程度。一种用于向基板上的可流动抗蚀剂材料赋予图案的方法,需要提供如此薄的抗蚀剂层,以使得在压模楔入过程中,抗蚀剂永远不会完全填充基板与楔形突起之间的压模底面之间的空间,从而留下它们之间无处不在。在抗蚀剂和压模的延伸表面之间保持间隙。

著录项

  • 公开/公告号SG11201400622SA

    专利类型

  • 公开/公告日2014-04-28

    原文格式PDF

  • 申请/专利权人 1366 TECHNOLOGIES INC.;

    申请/专利号SG11201400622S

  • 发明设计人 SACHS EMANUEL M.;

    申请日2012-09-22

  • 分类号H01L31/18;

  • 国家 SG

  • 入库时间 2022-08-21 15:55:47

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