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ADHERED SUBSTANCES REMOVING DEVICE, AND VAPOR DEPOSITION SYSTEM AND REMOVAL METHOD USING SUCH ADHERED SUBSTANCES REMOVING DEVICE
ADHERED SUBSTANCES REMOVING DEVICE, AND VAPOR DEPOSITION SYSTEM AND REMOVAL METHOD USING SUCH ADHERED SUBSTANCES REMOVING DEVICE
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机译:附着物去除装置以及使用该附着物去除装置的蒸气沉积系统和去除方法
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摘要
Provided is an adhered substances removing device that removes adhered substances adhered to a workpiece. The adhered substances removing device includes: a particulate injecting unit that faces the workpiece, injects a particulate, which sublimates in an atmosphere toward the workpiece, and releases adhered substances from the workpiece; and a dry gas supplying unit that supplies dry gas to the atmosphere in which the particulate is injected onto the workpiece by the particulate injecting unit.
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