首页> 外国专利> SEMICONDUCTOR DEVICE WITH VERTICAL TRANSISTORS HAVING A SURROUNDING GATE AND A WORK-FUNCTION METAL AROUND AN UPPER SIDEWALL

SEMICONDUCTOR DEVICE WITH VERTICAL TRANSISTORS HAVING A SURROUNDING GATE AND A WORK-FUNCTION METAL AROUND AN UPPER SIDEWALL

机译:带有垂直晶体管的半导体器件,其栅极围绕着上壁,工作金属环绕着上侧壁

摘要

A method of manufacturing a semiconductor device includes a first step of forming a fin-shaped semiconductor layer, a first insulating film around the fin-shaped semiconductor layer, and a pillar-shaped semiconductor layer on the fin-shaped semiconductor layer. A second step forms a gate insulating film around the pillar-shaped semiconductor layer, a gate electrode around the gate insulating film, and a gate line. A third step forms a first first-conductivity-type diffusion layer in an upper portion of the pillar-shaped semiconductor layer and a second first-conductivity-type diffusion layer in a lower portion of the pillar-shaped semiconductor layer and an upper portion of the fin-shaped semiconductor layer. A fourth step includes depositing, planarizing, and etching-back a first interlayer insulating film to expose an upper portion of the pillar-shaped semiconductor layer, depositing a first metal, and etching the metal to form a first sidewall around the upper portion of the pillar-shaped semiconductor layer.
机译:制造半导体器件的方法包括形成鳍状半导体层的第一步骤,围绕鳍状半导体层的第一绝缘膜以及在鳍状半导体层上的柱状半导体层的步骤。第二步骤在柱状半导体层的周围形成栅绝缘膜,在栅绝缘膜周围的栅电极和栅极线。第三步骤在柱状半导体层的上部形成第一第一导电型扩散层,并且在柱状半导体层的下部和绝缘层的上部形成第二第一导电型扩散层。鳍状半导体层。第四步骤包括沉积,平坦化和回蚀第一层间绝缘膜以暴露柱状半导体层的上部,沉积第一金属,以及蚀刻该金属以形成围绕该半导体层的上部的第一侧壁。柱状半导体层。

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