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FLIP-CHIP LED, METHOD FOR MANUFACTURING THE SAME AND FLIP-CHIP PACKAGE OF THE SAME
FLIP-CHIP LED, METHOD FOR MANUFACTURING THE SAME AND FLIP-CHIP PACKAGE OF THE SAME
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机译:FLIP-CHIP LED,其制造方法和相同的FLIP-CHIP包装
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摘要
A flip-chip LED, a method for manufacturing the same and a flip-chip LED package are revealed. The LED includes at least one multi-layer reflective layer covered over the outermost layer thereof. The multi-layer reflective layer includes non-conductive reflective layer or combination of the non-conductive reflective layer with conductive reflective layer. The multi-layer reflective layer is manufactured by physical vapor deposition (PVD) with a mask at one time. The mask is used to form a pattern of the multi-layer reflective layer. Thus a photoresist layer is further formed on surface of exposed electrodes. Then a pumping and venting process is used only once during to complete vacuum deposition of each layer of the multi-layer reflective layer in turn.
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