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Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
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1.
Phosphor temperature reduction by optimizing the phosphor configuration in white light-emitting diode package
机译:
通过优化白色发光二极管封装中的荧光粉配置来降低荧光粉温度
作者:
Hu Run
;
Jinyan Hu
;
Luo Xiaobing
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Finite element analysis;
Heating;
Light emitting diodes;
Optical scattering;
Phosphors;
Thermal management;
2.
Thermal management of an IGBT module using two-phase cooling
机译:
使用两相冷却的IGBT模块的热管理
作者:
Malu Neha
;
Bora Disha
;
Nakanekar Satej
;
Tonapi Sandeep
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Cold plates;
Conductivity;
Heat transfer;
Insulated gate bipolar transistors;
Inverters;
IGBT;
Two-phase cooling;
thermal management;
3.
Simulation and measurement of heat flow in recessed LED fixtures mounted in a UL box
机译:
模拟和测量安装在UL盒中的嵌入式LED灯具中的热流
作者:
Dreeben Thomas D
;
Betts David
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Abstracts;
Atmospheric modeling;
Engines;
Floors;
Geometry;
Heating;
convection;
modeling;
recessed fixtures;
solid-state lighting;
thermal;
4.
Energy saving potential of low-temperature cooling of computers
机译:
电脑低温冷却的节能潜力
作者:
Khalifa H.Ezzat
;
Erden Hamza Salih
;
de Rouge Romain B.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Absorption;
Coolants;
Energy consumption;
Power demand;
Servers;
Temperature distribution;
leakage power;
power and refrigeration cascade system;
subzero cooling;
5.
Reliability of flip chip on flexible substrates under drop impact
机译:
跌落冲击下倒装芯片在柔性基板上的可靠性
作者:
Mulla Mohasin
;
Bonde Kalpesh
;
Sabale Mayur
;
Thakur Shiwani
;
Tonapi Sandeep
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Abstracts;
Concrete;
Copper;
Flexible printed circuits;
Joints;
Reliability;
Substrates;
Drop impact;
Equivalent plastic strain;
Finite Element Analysis;
Flip Chip on Flex;
Multiple drops;
Reliability;
Underfill;
Von mises stress;
6.
The effect of cooling from surface of power Si MOSFET on hot spot temperature
机译:
功率Si MOSFET表面冷却对热点温度的影响
作者:
Kibushi Risako
;
Hatakeyama Tomoyuki
;
Nakagawa Shinji
;
Ishizuka Masaru
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Equations;
Heat transfer;
Lattices;
MOSFET;
Mathematical model;
Silicon;
Temperature distribution;
Thermal design;
cooling;
electro-thermal analysis;
p-n junction;
semiconductor device;
7.
Analysis and characterization of thermal transport in GaN HEMTs on Diamond substrates
机译:
金刚石衬底上GaN HEMT中热传输的分析和表征
作者:
Altman David
;
Tyhach Matthew
;
McClymonds James
;
Kim Samuel
;
Graham Samuel
;
Cho Jungwan
;
Goodson Kenneth
;
Francis Daniel
;
Faili Firooz
;
Ejeckam Felix
;
Bernstein Steven
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Diamonds;
Gallium nitride;
HEMTs;
Logic gates;
MODFETs;
Substrates;
Temperature measurement;
CVD Diamond;
Electro-thermal Modeling;
Gate Thermometry;
High Electron Mobility Transistor;
Micro-Raman Thermography;
8.
Enhanced pool-boiling heat transfer and critical heat flux using femtosecond laser surface processing
机译:
飞秒激光表面处理增强了池沸腾传热和临界热通量
作者:
Kruse Corey M.
;
Anderson Troy
;
Wilson Chris
;
Zuhlke Craig
;
Alexander Dennis
;
Gogos George
;
Ndao Sidy
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Copper;
Heat transfer;
Heating;
Microstructure;
Surface emitting lasers;
Surface treatment;
Temperature measurement;
Critical Heat Flux;
Femtosecond Laser Surface Processing;
Metallic Surface Enhancement;
Pool Boiling;
heat transfer coefficient;
9.
Mechanical and thermal properties of copper inverse opals for two-phase convection enhancement
机译:
铜反蛋白石的机械和热学性质,用于增强两相对流
作者:
Won Yoonjin
;
Barako Michael T.
;
Agonafer Damena D.
;
Asheghi Mehdi
;
Goodson Kenneth E.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Conductivity;
Copper;
Films;
Heating;
Mathematical model;
Resonant frequency;
Thermal conductivity;
inverse opal;
modulus;
nanoengineered structures;
porous structures;
thermal conductivity;
10.
Failure analysis of thermal degradation of TIM during power cycling
机译:
功率循环期间TIM热降解的失效分析
作者:
Zhang H.
;
Li S.
;
Liu H.
;
Bunt J.
;
Pompeo F.
;
Sikka K.
;
Rivera K.C.
;
Longworth H.
;
Lian C.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Degradation;
Electronic packaging thermal management;
Materials;
Metals;
Reliability;
Stress;
Thermal degradation;
Failure Analysis;
Power Cycling;
TIM;
Thermal Aging;
Thermomechanical;
11.
Effects of moisture exposure on the mechanical behavior of flip chip underfills in microelectronic packaging
机译:
湿气暴露对微电子封装倒装芯片底部填充材料力学性能的影响
作者:
Chhanda Nusrat J.
;
Suhling Jeffrey C.
;
Lall Pradeep
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Creep;
Moisture;
Stress;
Temperature;
Temperature measurement;
Testing;
Creep;
Material Behavior;
Moisture;
Prony Series;
Shift Function;
Stress-Strain;
Underfill;
Viscoelastic;
12.
A reduced order thermal model with application to multi-fin field effect transistor structure
机译:
降阶热模型及其在多鳍场效应晶体管结构中的应用
作者:
Wangkun Jia
;
Helenbrook Brian T.
;
Cheng Ming-C.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Abstracts;
Metals;
Reliability;
Synchronization;
FinFET;
compact thermal model (CTM);
proper orthogonal decomposition (POD);
reduce order model;
thermal simulation;
13.
Thermoelectric performance model development and validation for a selection and design tool
机译:
选择和设计工具的热电性能模型开发和验证
作者:
Nunnally Thomas
;
Pellicone Devin
;
Van Velson Nathan
;
Schmidt James
;
Desai Tapan
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Heat sinks;
Resistance heating;
Temperature measurement;
Thermal resistance;
COTS;
avionics;
thermal management;
thermal modeling;
thermoelectric cooling;
14.
High heat flux heat pipes embedded in metal core printed circuit boards for LED thermal management
机译:
嵌入金属芯印刷电路板中的高热通量热管,用于LED热管理
作者:
Pounds Dan
;
Bonner Richard W.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Heat sinks;
Heat transfer;
Light emitting diodes;
Resistance heating;
Thermal resistance;
Metal Core Printed Circuit Board;
Two-phase passive cooling;
heat pipes;
high heat flux;
high power LEDs;
15.
Numerical simulations of viscoelastic flow over a confined cylinder in microchannels
机译:
微通道中密闭圆柱体上粘弹性流动的数值模拟
作者:
Lei S.
;
Nolan K.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Heat transfer;
Microchannels;
Polymers;
Tensile stress;
Viscosity;
CFD;
Oldroyd-B model;
elastic turbulence;
microfluidics;
viscoelastic flows;
16.
CHF enhancement of Al
2
O
3
, TiO
2
and Ag nanofluids and effect of nucleate pool boiling time
机译:
CHF增强Al
2 inf> O
3 inf>,TiO
2 inf>和Ag纳米流体以及核池沸腾时间的影响
作者:
Ulcay Mehmed Sitki
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Coatings;
Heat transfer;
Heating;
Nanofluidics;
Nanoparticles;
Surface treatment;
Wires;
CHF;
Nanofluid Coating Time Effect;
Nucleate Boiling Time;
Pool Boiling;
Surface Coating;
17.
Experimental investigation of direct attach microprocessors in a Liquid-Cooled chiller-less Data Center
机译:
无液冷无数据中心的直接连接微处理器的实验研究
作者:
Schultz Mark
;
Gaynes Michael
;
Parida Pritish
;
Chainer Timothy
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Coolants;
Heating;
Liquid cooling;
Servers;
Temperature distribution;
Temperature measurement;
Thermal interface materials;
data centers;
liquid cooling;
liquid metal;
18.
Real time thermal management controller for data center
机译:
数据中心实时热管理控制器
作者:
Shu Zhang
;
Tianyu Zhou
;
Ahuja Nishi
;
Refai-Ahmed Gamal
;
Yongzhong Zhu
;
Guofeng Chen
;
Zhihua Wang
;
Weiwei Song
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Cooling;
Real-time systems;
Servers;
Temperature distribution;
Temperature sensors;
Thermal management;
Airflow;
Control strategy;
Cooling;
Efficiency;
Sensor;
Simulation;
Temperature;
Thermal;
Thermal safety;
Total cost of ownership;
19.
A physics-based compact thermal model for multi-gate field effect transistor structures
机译:
用于多栅场效应晶体管结构的基于物理的紧凑热模型
作者:
Smith Jeffrey A.
;
Wangkun Jia
;
Cheng Ming-C.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Heating;
Integrated circuit modeling;
Logic gates;
Metals;
Periodic structures;
Thermal resistance;
Wires;
MuGFET;
compact thermal model;
heat loss;
least squares method;
thermal coupling;
thermal length;
20.
Parametric design of a low-profile, forced convection heat sink for high-power, high-density LED arrays
机译:
用于高功率,高密度LED阵列的薄型强制对流散热器的参数设计
作者:
Geisler Karl J.L.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Heat sinks;
Heating;
Junctions;
Light emitting diodes;
Lighting;
Thermal conductivity;
Thermal resistance;
Air Cooling;
Light Emitting Diode;
Solid State Lighting;
Thermal Management;
21.
Cooling performance of ceiling-plenum-ducted containment systems in data centers
机译:
数据中心中的天花板通风管道围护系统的制冷性能
作者:
VanGilder James W.
;
Zhang Xuanhang
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Atmospheric modeling;
Computational fluid dynamics;
Cooling;
Data models;
Ducts;
Floors;
Resistance;
CFD;
Ceiling Plenum;
Compact Model;
Cooling Performance;
Data Center Cooling;
Dropped Ceiling;
Ducted Containment System;
Flow Network Model (FNM);
22.
Experimental development of a near junction microchannel heat spreader
机译:
近结微通道散热器的实验开发
作者:
Weaver Stanton
;
Mandrusiak Gary
;
Nannan Chen
;
Boomhower Oliver
;
Brewer Joleyn
;
Davis Robert
;
Vetury Ramakrishna
;
Henry Haldane
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Cooling;
Fluid flow measurement;
Manifolds;
Microchannels;
Pressure measurement;
Temperature measurement;
Valves;
device cooling;
diaphragm pump;
electronics cooling;
micro Raman spectroscopy;
microchannel;
shape-memory alloy valves;
thermal management;
23.
Detailed and reduced order modeling of steady state counterflow mechanical draft cooling towers for analysis of Data Center energy efficiency
机译:
稳态逆流机械通风冷却塔的详细和降阶建模,用于数据中心能源效率分析
作者:
Abbasi Kayvan
;
Wemhoff Aaron P.
;
Ortega Alfonso
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Artificial neural networks;
Atmospheric modeling;
Cooling;
Heat transfer;
Mathematical model;
Poles and towers;
Temperature;
Cooling Tower;
Data Center;
Exergy Destruction;
Thermal Management;
24.
Inverse opals for fluid delivery in electronics cooling systems
机译:
反蛋白石,用于电子冷却系统中的流体输送
作者:
Dusseault Thomas J.
;
Gires Julie
;
Barako Michael T.
;
Yoonjin Won
;
Agonafer Damena D.
;
Asheghi Mehdi
;
Santiago Juan G.
;
Goodson Kenneth E.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Copper;
FCC;
Fluids;
Heating;
Permeability;
Permeability measurement;
fabrication;
inverse opal;
metal foam;
modeling;
permeability;
porous media;
25.
Effect of hydrodynamic and thermal slip on droplet based thermal management systems
机译:
流体动力和热滑动对基于液滴的热管理系统的影响
作者:
Thalakkottor Joseph J
;
Mohseni Kamran
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Heating;
Lead;
26.
Thermal Modeling Improvements using substrate ECAD integration
机译:
使用基板ECAD集成改进热建模
作者:
Jha Vibhash
;
Hauck Torsten
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Copper;
Electronic packaging thermal management;
Junctions;
Substrates;
Thermal force;
Thermal management;
Thermal resistance;
substrate ECAD model;
thermal management of electronic packages;
27.
Diamond for enhanced GaN device performance
机译:
钻石可增强GaN器件的性能
作者:
Ejeckam Felix
;
Francis Daniel
;
Faili Firooz
;
Dodson Joe
;
Twitchen Daniel J.
;
Bolliger Bruce
;
Babic Dubravko
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Diamonds;
Gallium nitride;
HEMTs;
Substrates;
Thermal conductivity;
Thermal resistance;
CVD diamond;
GaN;
high-electron-mobility transistor (HEMT);
thermal interface;
thermal management;
28.
Nanoporous evaporative device for advanced electronics thermal management
机译:
纳米孔蒸发装置,用于高级电子热管理
作者:
Hanks Daniel F.
;
Zhengmao Lu
;
Narayanan Shankar
;
Bagnall Kevin R.
;
Raj Rishi
;
Xiao Rong
;
Enright Ryan
;
Wang Evelyn N.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Cooling;
Heat transfer;
Heating;
Liquids;
Resistance;
Substrates;
evaporation;
membrane;
phase-change;
29.
Transient effectiveness characteristics of cross flow heat exchangers in data center cooling systems
机译:
数据中心冷却系统中错流热交换器的瞬态效率特性
作者:
Gao Tianyi
;
Sammakia Bahgat
;
Geer James
;
Ortega Alfonso
;
Schmidt Roger
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Cooling;
Fluids;
Heat transfer;
Mathematical model;
Transient analysis;
Water heating;
Crossflow heat exchanger;
Data Center;
Dynamic performance;
Transient effectiveness;
30.
Thermal management of electronic components using Makrolon polycarbonate and Bayflex polyurethane
机译:
使用模克隆聚碳酸酯和Bayflex聚氨酯对电子组件进行热管理
作者:
Davis Terry G.
;
Rocco Dave
;
Lorenzo James
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Assembly;
Encapsulation;
Heat sinks;
Light emitting diodes;
Materials;
Thermal conductivity;
Thermal management of electronics;
Bayflex;
LED;
Makrolon;
conductive;
encapsulation;
heat sink;
injection;
mold;
polymer;
thermal;
31.
Direct liquid cooling of bare die packages using a microchannel cold plate
机译:
使用微通道冷板直接对裸芯片封装进行液体冷却
作者:
Acikalin Tolga
;
Schroeder Chris
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Cold plates;
Microchannels;
Temperature measurement;
Temperature sensors;
Thermal resistance;
Vehicles;
cold plate;
direct liquid cooling;
microchannels;
32.
Efficiency optimization for a frictionless air flow blade fan - Design study
机译:
无摩擦气流叶片风扇的效率优化-设计研究
作者:
Schacht R.K.B.
;
Hausdorf A.
;
Wunderle B.
;
Rzepka S.
;
Michel B.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Blades;
Coils;
Inductance;
Materials;
Shape;
Springs;
Steel;
frictionless cooling;
nearly noiseless cooling;
reliable air flow fan;
thermal management;
33.
Generic thermal modeling study of the impact of 3D -interposer material and thickness options on the thermal performance and die-to-die thermal coupling
机译:
3D中介层材料和厚度选项对热性能和芯片间热耦合影响的通用热建模研究
作者:
Oprins H.
;
Beyne E.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Conductivity;
Electronic packaging thermal management;
Glass;
Heating;
Silicon;
Thermal conductivity;
Three-dimensional displays;
2.5D integration;
3D integration;
Si interposer;
glass interposer;
passive interposer;
thermal modeling;
34.
SSL and LED life prediction and assessment of CCT shift
机译:
SSL和LED寿命预测以及CCT偏移评估
作者:
Lall Pradeep
;
Sakalaukus Peter
;
Wei Junchao
;
Davis Lynn
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Bayes methods;
Degradation;
Equations;
Mathematical model;
Maximum likelihood estimation;
Standards;
Testing;
Bayesian;
L70 Life;
LED;
Lumen Maintenance;
Reliability;
Solid-State Lighting;
35.
Investigation of thermal interface materials using phase-sensitive transient thermoreflectance technique
机译:
使用相敏瞬态热反射技术研究热界面材料
作者:
Feng Xuhui
;
King Charlie
;
DeVoto Doug
;
Mihalic Mark
;
Narumanchi Sreekant
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Electronic packaging thermal management;
Heating;
Laser excitation;
Materials;
Pump lasers;
Thermal conductivity;
Thermal resistance;
Thermal interface materials;
bulk thermal conductivity;
contact resistance;
phase-sensitive transient thremoreflectance;
thermophysical properties;
36.
Towards development of a passive datacenter cooling technology: On-server thermosyphon cooling loop under dynamic workload
机译:
致力于开发无源数据中心冷却技术:动态工作负载下的服务器上热虹吸冷却回路
作者:
Marcinichen Jackson B.
;
Szczukiewicz Sylwia
;
Lamaison Nicolas
;
Thome John R.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Coolants;
Fluids;
Heat transfer;
Servers;
Water heating;
datacenter workload;
dielectric working fluids;
high heat flux servers;
thermosyphon cooling loop;
two-phase flow;
37.
An overview of the IBM zEnterprise EC12 processor cooling system
机译:
IBM zEnterprise EC12处理器冷却系统概述
作者:
Goth Gary
;
Mullady Robert
;
Zoodsma Randy
;
Cory VanDeventer A.
;
Porter Donald
;
Kelly Peter
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
CMOS integrated circuits;
Clocks;
Refrigerants;
Servers;
Water heating;
38.
Thermal management of surveillance equipments electronic components using pulsating heat pipes
机译:
使用脉动热管的监视设备电子组件的热管理
作者:
Riehl Roger R.
;
Cachute Liomar de O.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Heat sinks;
Heat transfer;
Heating;
Reliability;
Surveillance;
Temperature distribution;
electronics cooling;
pulsating heat pipe;
surveillance;
thermal control;
39.
Material behavior of SAC305 under high strain rate at high temperature
机译:
SAC305在高温高应变速率下的材料行为
作者:
Lall Pradeep
;
Di Zhang
;
Yadav Vikas
;
Suhling Jeff
;
Shantaram Sandeep
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Abstracts;
Cameras;
Displacement measurement;
Electron tubes;
Heating;
Lead;
Anand viscoplastic model;
High strain rate;
Leadfree;
SAC 305;
40.
Cooling heat flux, COP, and cost optimization of integrated thermoelectric microcoolers with variation of thermoelectric properties
机译:
随热电特性变化的集成热电微型冷却器的冷却热通量,COP和成本优化
作者:
Yee Rui Koh
;
Yazawa Kazuaki
;
Shakouri Ali
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Conductivity;
Cooling;
Heating;
Integrated circuit modeling;
Materials;
Optimized production technology;
Thermal conductivity;
coefficient of performance;
cooling heat flux;
energy efficiency;
hot spot;
microcooler;
thermoelectric;
41.
Transient thermal analysis of the microprocessor system one-dimensional thermal network with power estimation equation
机译:
带有功率估计方程的微处理器系统一维热网络的瞬态热分析
作者:
Nishi Koji
;
Hatakeyama Tomoyuki
;
Nakagawa Shinji
;
Ishizuka Masaru
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Heat sinks;
Heat transfer;
Resistance heating;
Thermal analysis;
Thermal resistance;
Transient analysis;
One-dimensional fin;
Thermal local resistance;
Thermal spreading resistance;
Transient behavior;
Transient thermal resistance;
42.
Experimental investigation on boiling heat transfer coefficient enhancement using grooves for cooling of electronic devices
机译:
利用沟槽冷却电子设备提高沸腾传热系数的实验研究
作者:
Sathyabhama A.
;
Prashanth S.P.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Cooling;
Copper;
Heat transfer;
Rough surfaces;
Surface roughness;
Water heating;
Pool boiling;
electronic cooling;
enhancement;
grooved surface;
43.
Tailored parallel micro-channel cooling for hot spot mitigation
机译:
量身定制的并行微通道冷却,可减轻热点
作者:
Solovitz Stephen A.
;
Lewis Matthew
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Correlation;
Heat sinks;
Heat transfer;
Heating;
Mathematical model;
Temperature distribution;
hot spots;
micro-channels;
thermal management;
44.
Effect of underfill design parameters on die cracking in flip chip on flexible substrates
机译:
底部填充设计参数对柔性基板倒装芯片上芯片开裂的影响
作者:
Sabale Mayur
;
Vinerkar Kiran
;
Thakur Shiwani
;
Tonapi Sandeep
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Electronic packaging thermal management;
Finite element analysis;
Flip-chip devices;
Reliability;
Stress;
Substrates;
Thermal stresses;
Accelerated Thermal cycling;
Die Cracking;
Finite Element Analysis;
Flexible Substrate;
Flip Chip;
Rigid substrate;
Underfill Fillet;
45.
Analysis for upper limit of air cooling by engineered porous metal heat sinks
机译:
工程多孔金属散热器的空气冷却上限分析
作者:
Trifale Ninad
;
Nauman Eric
;
Yazawa Kazuaki
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Correlation;
Fluids;
Heat sinks;
Heat transfer;
Mathematical model;
Permeability;
Solids;
46.
Benefits of properly sealing a cold aisle containment system
机译:
正确密封冷通道密闭系统的好处
作者:
Makwana Yasin U.
;
Calder Andrew R.
;
Shrivastava Saurabh K.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Abstracts;
Cooling;
Heating;
Radio frequency;
Vents;
47.
A review of challenging issues in the integration of absorption refrigeration and organic Rankine Cycle into a data center cooling system
机译:
吸收式制冷和有机朗肯循环集成到数据中心冷却系统中的挑战性问题综述
作者:
Ebrahimi Khosrow
;
Jones Gerard
;
Fleischer Amy
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Absorption;
Cooling;
Generators;
Heat recovery;
Servers;
Waste heat;
Coefficient of Performance;
absorption refrigeration;
data center;
efficiency;
integration;
liquid cooling;
novel heat recovery system;
organic Rankine cycle;
two-phase cooling;
waste heat recovery;
48.
Effect of solder joint size on fatigue life of WL-CSP under accelerated thermal cycling using FEM
机译:
FEM加速热循环下焊点尺寸对WL-CSP疲劳寿命的影响
作者:
Bajad Nupur
;
Kulkarni Harshada
;
Dhole Satish
;
Thakur Shiwani
;
Tonapi Sandeep
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Creep;
Fatigue;
Finite element analysis;
Load modeling;
Mathematical model;
Plastics;
Soldering;
Solder ball diameter;
Successive Initiation method;
Thermo-mechanical reliability;
Wafer level chip scale package;
49.
The influence of nanoparticle loading and surfactant on the viscosity of nanoenhanced energy storage materials
机译:
纳米颗粒负载量和表面活性剂对纳米增强储能材料粘度的影响
作者:
Weigand Rebecca
;
Fleischer Amy S.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Abstracts;
Facsimile;
dynamic viscosity;
phase change material;
50.
Measurements of interfacial strengths in underfilled flip-chip electronic packages using Wedge Delamination Method (WDM)
机译:
使用楔形分层法(WDM)测量底部填充的倒装芯片电子封装中的界面强度
作者:
Sinha Tuhin
;
Sikka Kamal K.
;
Yannitty David N.
;
Bodenweber Paul F.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Abstracts;
Delamination;
Equations;
Silicon;
Stress;
Wavelength division multiplexing;
Chip-package interaction (CPI);
Encapsulant;
Underfill;
delamination;
fracture toughness;
interfacial failure;
silicon die;
51.
A corrosion and erosion protection coating for complex microchannel coolers used in high power laser diodes
机译:
用于大功率激光二极管的复杂微通道冷却器的腐蚀和腐蚀防护涂层
作者:
Desai Tapan G.
;
Flannery Matthew
;
Fan Angie
;
Weyant Jens
;
Eppich Henry
;
Lang Keith
;
Chin Richard
;
Chin Aland
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Coatings;
Copper;
Corrosion;
Diode lasers;
Gold;
Thermal resistance;
electrochemical impedance spectroscopy analysis;
erosion and corrosion testing;
laser diode thermal management;
liquid cooling;
nanoscale coating;
52.
Micro-fluidic silicon cooling devices for particle tracking detectors
机译:
用于微粒跟踪探测器的微流控硅冷却装置
作者:
Romagnoli G.
;
Buytaert J.
;
Dumps R.
;
Francescon A.
;
De Aguiar Francisco O.A.
;
Howell K.
;
Mapelli A.
;
Nuessle G.
;
Petagna P.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Connectors;
Cooling;
Detectors;
Heating;
Silicon;
Temperature sensors;
Cooling;
Front-End Electronics;
High-Energy Physics;
Micro-fabrication;
Micro-fluidics;
Particle Detectors;
53.
Latest developments of compact thermal modeling of system-in-package devices by means of Genetic Algorithm
机译:
基于遗传算法的系统级封装紧凑热模型的最新进展
作者:
Monier-Vinard Eric
;
Bissuel Valentin
;
Laraqi Najib
;
Dia Cheikh
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Electronic packaging thermal management;
Genetic algorithms;
Heating;
Numerical models;
Surface treatment;
Temperature measurement;
Thermal resistance;
Compact thermal model;
Experimental;
Genetic algorithm;
Infrared images;
SIP;
54.
Global-local finite element optimization study to minimize BGA damage under thermal cycling
机译:
全局局部有限元优化研究可最大程度地减少热循环下的BGA损坏
作者:
Deshpande Abhishek
;
Khan Hassan
;
Mirza Fahad
;
Agonafer Dereje
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Analytical models;
Computational modeling;
Finite element analysis;
Optimization;
Reliability;
Soldering;
Strain;
BGA;
Multi-Variable-Design-optimization;
Sub-modelling;
55.
Effects of moisture exposure on the mechanical behavior of polycarbonate materials used in electronic packaging
机译:
湿气暴露对电子包装中聚碳酸酯材料机械性能的影响
作者:
Chhanda Nusrat J.
;
Suhling Jeffrey C.
;
Canumalla Sridhar
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Moisture;
Polymers;
Strain;
Stress;
Temperature;
Testing;
Humidity;
Hygrothermal Exposure;
Material Behavior;
Moisture Adsorption;
Polycarbonate;
Reversibility;
Stress-Strain Curve;
56.
Further exploration of a compact transient server model
机译:
紧凑型瞬态服务器模型的进一步探索
作者:
Pardey Zachary M.
;
VanGilder James W.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Atmospheric modeling;
Capacitance;
Heating;
Mathematical model;
Servers;
Temperature measurement;
Transient analysis;
CFD;
Capacitance;
Compact Model;
Data Center Cooling;
Server Airflow;
Server Mass Density;
Server Thermal Effectiveness;
Thermal Mass;
Transient;
57.
Experimental characterization and modeling of a water-cooled server cabinet
机译:
水冷服务器机柜的实验表征和建模
作者:
Nemati Kourosh
;
Murray Bruce T.
;
Sammakia Bahgat
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Atmospheric modeling;
Computational modeling;
Cooling;
Servers;
Temperature measurement;
Water heating;
data center thermal management;
heat exchanger effectiveness;
water-cooled server cabinet;
58.
Flat heat pipe performance thresholds at ultra-thin form factors
机译:
超薄外形的扁平热管性能阈值
作者:
Yadavalli Yashwanth
;
Weibel Justin A
;
Garimella Suresh V
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Mathematical model;
Numerical models;
Performance evaluation;
Resistance heating;
Thermal resistance;
flat heat pipe;
low heat flux;
numerical model;
performance limits;
ultra-thin vapor chamber;
59.
Enhancing thermal performance in embedded computing for ruggedized military and avionics applications
机译:
在加固型军事和航空电子应用中增强嵌入式计算的热性能
作者:
Campo Darren
;
Weyant Jens
;
Muzyka Bryan
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Aluminum;
Heat sinks;
Heat transfer;
Heating;
Rails;
electronics cooling;
embedded computing;
heat pipe;
high thermal conductivity;
thermal;
60.
Anisotropic and nonhomogeneous thermal conduction in 1 #x00B5;m thick CVD diamond
机译:
1 µm厚CVD金刚石中的各向异性和非均匀导热
作者:
Sood Aditya
;
Jungwan Cho
;
Hobart Karl D.
;
Feygelson Tatyana
;
Pate Bradford
;
Asheghi Mehdi
;
Goodson Kenneth E.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Conductivity;
Conductivity measurement;
Diamonds;
Films;
Frequency modulation;
Sensitivity;
Thermal conductivity;
CVD diamond;
coalescence and growth;
columnar anisotropy;
heat spreaders;
thermal boundary resistance (TBR);
time-domain thermoreflectance (TDTR);
61.
Enhanced performance of a thermal ground plane utilizing an Inorganic Aqueous Solution
机译:
利用无机水溶液增强了热接地层的性能
作者:
Karimi Armin
;
Reilly Sean
;
Catton Ivan
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Fluids;
Heat transfer;
Performance evaluation;
Resistance;
Resistance heating;
Temperature measurement;
Converging wick;
Electronic cooling;
Heat spreader;
Heat transfer enhancement;
IAS;
Inorganic Aqueous Solution;
Monoporous wick;
TGP;
Thermal Ground Plane;
Vapor Chamber;
62.
Dynamic models for server rack and CRAH in a room level CFD model of a data center
机译:
数据中心机房CFD模型中服务器机架和CRAH的动态模型
作者:
Alkharabsheh Sami
;
Sammakia Bahgat
;
Shrivastava Saurabh
;
Schmidt Roger
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Coils;
Computational modeling;
Cooling;
Data models;
Servers;
Water heating;
CRAC failure;
CRAH/CRAC heat capacity;
Data center;
calibration and validation;
power outage;
rack heat capacity;
server heat capacity;
transient analysis;
63.
Thermal performance modeling of hybrid liquid-air cooled servers
机译:
混合气冷服务器的热性能建模
作者:
Zeighami Roy
;
Saunders Winston A.
;
Coles Henry
;
Branton Steve
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Heat recovery;
Liquid cooling;
Power measurement;
Servers;
Temperature measurement;
Water heating;
air;
cooling;
data center;
energy reuse;
liquid;
power;
server;
water cooling;
64.
Local and global dimensional CFD simulations and analyses to optimize server-fin design for improved energy efficiency in data centers
机译:
本地和全局CFD CFD仿真和分析可优化服务器鳍设计,以提高数据中心的能源效率
作者:
Sakaino Hidetomo
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Abstracts;
Equations;
Floors;
Heating;
Mathematical model;
Servers;
Tin;
aerodynamics;
computational fluid dynamics;
energy efficiency;
extended RHI;
local and global analysis;
purpose-oriented graphical user interface;
server-fin;
temperature change rate;
time series analysis;
65.
Thermal conductivity reduction by nanophononic metamaterials
机译:
纳米声子超材料降低热导率
作者:
Davis B.L.
;
Hussein M.I.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
66.
Simulations of damage and fracture in ULK under pad structures during Cu wirebond process
机译:
铜丝键合过程中BULK垫下结构的损坏和断裂的模拟
作者:
Upreti Kritika
;
Hung-Yun Lin
;
Subbarayan Ganesh
;
Jung Dae Young
;
Sammakia Bahgat
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Acoustics;
Approximation methods;
Geometry;
Load modeling;
Material properties;
Wires;
ULK;
damage;
fracture;
reliability;
wire bonding;
67.
High thermal conductivity ultra-high molecular weight polyethylene (UHMWPE) films
机译:
高导热率超高分子量聚乙烯(UHMWPE)膜
作者:
Ghasemi Hadi
;
Thoppey Nagarajan
;
Xiaopeng Huang
;
Loomis James
;
Xiaobo Li
;
Tong Jonathan
;
Jianjian Wang
;
Chen Gang
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Conductivity;
Films;
Heating;
Plastics;
Polyethylene;
Temperature measurement;
Thermal conductivity;
polymers;
thermal conductivity;
ultra-high molecular weight polyethylene;
68.
Increasing heat transfer during condensation on surfaces via lubricant impregnation
机译:
通过润滑剂浸渍在表面凝结过程中增加热传递
作者:
Anand Sushant
;
Paxson Adam
;
Rykaczewski Konrad
;
Varanasi Kripa K.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Heat transfer;
Liquids;
Lubricants;
Silicon;
Solids;
Surface texture;
Surface treatment;
dropwise condensation;
heat transfer;
nanotextured surfaces;
slippery surfaces;
69.
Phonon thermal conduction in periodically porous silicon nanobeams
机译:
周期性多孔硅纳米束中的声子热传导
作者:
Woosung Park
;
Marconnet Amy M.
;
Kodama Takashi
;
Joonsuk Park
;
Sinclair Robert
;
Asheghi Mehdi
;
Goodson Kenneth E.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Conductivity;
Metals;
Phonons;
Resistance;
Silicon;
Temperature measurement;
Thermal conductivity;
Holey Silicon;
Phononic Crystal;
Porous Silicon;
Silicon Porous Nanobeam;
Thermal Conductivity;
70.
Carbon based Thermal Interface Material for high performance cooling applications
机译:
碳基热界面材料,用于高性能冷却应用
作者:
Sauciuc Ioan
;
Yamamoto Rei
;
Culic-Viskota Jelena
;
Yoshikawa Toru
;
Jain Syadwad
;
Yajima Michiaki
;
Labanok Nick
;
Amoah-Kusi Christian
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Contact resistance;
Degradation;
Materials;
Thermal conductivity;
Thermal degradation;
Thermal resistance;
TIM1;
TIM2;
Thermal interface material;
VCTIM;
bulk conductivity;
carbon;
compression;
contact thermal resistance;
effective conductivity;
graphite;
thermal resistance;
71.
Transient thermal imaging characterization of a die attached optoelectronic device on silicon
机译:
硅片上贴片光电子器件的瞬态热成像表征
作者:
Yazawa Kazuaki
;
Kendig Dustin
;
Al-hemyari Kadhair
;
Shakouri Ali
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Heat sinks;
Passivation;
Silicon;
Substrates;
Thermal resistance;
Transient analysis;
optoelectronics;
passivation layer;
thermal imaging;
thermal resistance;
time response;
72.
Mass transport characteristics and theoretical performance limits of micropillar wicks
机译:
微柱芯的传质特性和理论性能极限
作者:
Ravi Saitej
;
Horner David
;
Moghaddam Saeed
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Geometry;
Gravity;
Heating;
Liquids;
Mathematical model;
Optimization;
Permeability;
Genetic algorithm;
Heat pipe;
Micropillar wick;
Modeling;
Optimization;
Porous media;
Theoretical limits;
Two-phase heat spreader;
73.
Assessing solder interconnect reliability of control boards in power electronic systems using Physics-of-Failure models
机译:
使用故障物理模型评估电力电子系统中控制板的焊料互连可靠性
作者:
Squiller David
;
Mengotti Elena
;
McCluskey Patrick
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Integrated circuit reliability;
Power dissipation;
Power electronics;
Surface treatment;
Temperature control;
Temperature measurement;
CalcePWA;
Control Boards;
Interco nnects;
Power Electronic Systems;
Reliability;
Solder;
74.
The effects of aging on the Anand viscoplastic constitutive model for SAC305 solder
机译:
时效对SAC305焊料的Anand粘塑性本构模型的影响
作者:
Basit Munshi M.
;
Motalab Mohammad
;
Suhling Jeffrey C.
;
Lall Pradeep
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Aging;
Electron tubes;
Environmentally friendly manufacturing techniques;
Equations;
Mathematical model;
Strain;
Stress;
Aging;
Anand Model;
Constitutive Relations;
Evolution;
Lead Free Solder;
Stress-Strain Curve;
75.
Analysis of flow and heat distribution in a 3D stack of chips and memories with back side two-phase cooling
机译:
具有背面两相冷却的3D芯片和存储器堆栈中的流动和热分布分析
作者:
dEntremont B.P.
;
Marcinichen J.B.
;
Thome J.R.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Cooling;
Fluids;
Heat transfer;
Heating;
Junctions;
Microchannels;
Silicon;
3D conduction;
Microchannel;
Through-Silicon Vias (TSVs);
hot spot;
integrated cooling;
microevaporator;
parallel flow;
76.
Characterization of moisture and thermally induced die stresses in flip chip on laminate assemblies
机译:
层压组件上倒装芯片中水分和热感应模头应力的表征
作者:
Quang Nguyen
;
Roberts Jordan C.
;
Suhling Jeffrey C.
;
Jaeger Richard C.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Assembly;
Electrical resistance measurement;
Semiconductor device measurement;
Stress;
Stress measurement;
Temperature measurement;
Temperature sensors;
77.
Transient wall temperature measurements of two-phase slug flow in a microchannel
机译:
微通道中两相段塞流的瞬态壁温测量
作者:
Houshmand Farzad
;
Peles Yoav
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Electrical resistance measurement;
Frequency measurement;
Heat transfer;
Resistance heating;
Substrates;
Temperature measurement;
Heat transfer;
Microchannel;
Slug flow;
Transient temperature;
Two-phase flow;
bubbles;
78.
An investigation into momentum and temperature fields of a meso-scale synthetic jet
机译:
中尺度合成射流的动量和温度场研究
作者:
Ghaffari Omidreza
;
Dogruoz M.Baris
;
Arik Mehmet
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Actuators;
Fluids;
Friction;
Heat transfer;
Heating;
Kinetic energy;
Skin;
CFD;
Synthetic jet;
impingement;
pulsating;
vortex;
79.
Modal control of unstable boiling states in three-dimensional nonlinear pool-boiling
机译:
三维非线性池沸腾中不稳定沸腾态的模态控制
作者:
van Gils R.W.
;
Speetjens M.F.M.
;
Zwart H.J.
;
Nijmeijer H.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Heat transfer;
Heating;
Observers;
Solid modeling;
Temperature measurement;
Temperature sensors;
Three-dimensional displays;
80.
Thermal analysis and optimization of 2.5D and 3D integrated systems with Wide I/O memory
机译:
具有宽I / O存储器的2.5D和3D集成系统的热分析和优化
作者:
Heinig Andy
;
Fischbach Robert
;
Dittrich Michael
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Heating;
Materials;
Optimization;
Power demand;
Temperature distribution;
Thermal conductivity;
Three-dimensional displays;
Thermal optimization;
floorplanning;
octree based finite element method;
81.
Novel power electronics three-dimensional heat exchanger
机译:
新型电力电子三维换热器
作者:
Bennion Kevin
;
Cousineau Justin
;
Lustbader Jason
;
Narumanchi Sreekant
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Computational fluid dynamics;
Cooling;
Electronic packaging thermal management;
Resistance heating;
Thermal resistance;
aluminum extrusions;
electric drive;
electric vehicle;
heat exchanger;
inverter;
power electronics;
thermal management;
water-ethylene glycol;
82.
Continued frequency scaling in 3D ICs through micro-fluidic cooling
机译:
通过微流体冷却在3D IC中持续进行频率缩放
作者:
Serafy Caleb
;
Srivastava Ankur
;
Yeung Donald
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Cooling;
Delays;
Heating;
Microchannels;
Parallel processing;
Random access memory;
Three-dimensional displays;
83.
Effects of droplet diameter on the Leidenfrost temperature of laser processed multiscale structured surfaces
机译:
液滴直径对激光加工多尺度结构化表面莱顿弗罗斯特温度的影响
作者:
Hassebrook Anton
;
Kruse Corey
;
Wilson Chris
;
Anderson Troy
;
Zuhlke Craig
;
Alexander Dennis
;
Gogos George
;
Ndao Sidy
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Materials;
Rough surfaces;
Steel;
Surface emitting lasers;
Surface roughness;
Surface topography;
Surface treatment;
84.
Predicting thermo-mechanical degradation of first-level thermal interface materials (TIMs) in flip-chip electronic packages
机译:
预测倒装芯片电子封装中第一级热界面材料(TIM)的热机械降解
作者:
Sinha Tuhin
;
Zitz Jeffery A.
;
Wagner Rebecca N.
;
Iruvanti Sushumna
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Degradation;
Electronic packaging thermal management;
Strain;
Temperature measurement;
Thermal degradation;
Thermal loading;
Finite element method (FEM);
Flip-chip packages;
Thermal Interface Material (TIM);
Thermal degradation;
reliability;
thermal cycling;
85.
High strain rate mechanical properties of SAC105 leadfree alloy at high operating temperatures
机译:
SAC105无铅合金在高工作温度下的高应变速率机械性能
作者:
Lall Pradeep
;
Yadav Vikas
;
Di Zhang
;
Suhling Jeff
;
Shantaram Sandeep
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Abstracts;
Deformable models;
Force;
Lead;
Strain;
Stress;
Tin;
ANAND#039;
s Viscoplastic model;
High strain rate;
86.
Two phase convective cooling for ultra-high power dissipation in microprocessors
机译:
两相对流冷却可实现微处理器的超高功耗
作者:
Kottke Peter A.
;
Yun Thomas M.
;
Green Craig E.
;
Joshi Yogendra K.
;
Fedorov Andrei G.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Coolants;
Friction;
Heat transfer;
Hidden Markov models;
Market research;
Mathematical model;
Thermodynamics;
microchannel boiling heat transfer;
microelectronics cooling;
microgap;
87.
Flow Rate and inlet temperature considerations for direct immersion of a single server in mineral oil
机译:
将单个服务器直接浸入矿物油中的流速和入口温度注意事项
作者:
Eiland Richard
;
Fernandes John
;
Vallejo Marianna
;
Agonafer Dereje
;
Mulay Veerendra
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Facsimile;
Generators;
Heating;
Instruction sets;
Kinematics;
Power measurement;
Workstations;
PUE;
component temperature;
data center efficiency;
mineral oil;
oil immersion;
server energy;
88.
Nanosecond time-resolved visualization of short pulse laser ablation processes for various laser beam profiles
机译:
纳秒级时间分辨的各种脉冲光束轮廓的短脉冲激光烧蚀过程的可视化
作者:
Doan Hong Duc
;
Iwatani Naoki
;
Sasaki Hiroyasu
;
Matsumura Satoshi
;
Fushinobu Kazuyoshi
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Cameras;
Laser ablation;
Laser beams;
Particle beams;
Plasmas;
Surface emitting lasers;
Visualization;
laser ablation;
laser beam profile;
short pulse laser;
thermo-fluid modeling;
time-resolved visualization;
ultra high speed camera;
89.
Limitations and accuracy of steady state technique for thermal characterization of thermal interface materials and substrates
机译:
热界面材料和基板热特性稳定技术的局限性和准确性
作者:
AboRas Mohamad
;
May Daniel
;
Schacht Ralph
;
Winkler Thomas
;
Rzepka Sven
;
Michel Bernd
;
Wunderle Bernhard
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Conductivity;
Heating;
Materials;
Temperature measurement;
Temperature sensors;
Thermal conductivity;
Thermal resistance;
Substrate characterization;
TIMA Tester;
Thermal Interface Materials;
accurate measurement;
interface resistance;
steady state;
thermal characterization;
thermal conductivity;
90.
Simulating the evaporation of pinned water microdroplets with implementation of a surface concentration distribution
机译:
通过实现表面浓度分布模拟固定水微滴的蒸发
作者:
Gleason Kevin
;
Putnam Shawn A.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Cooling;
Image edge detection;
Predictive models;
91.
Micro-mechanical characterization of lead-free solder joints in power electronics
机译:
电力电子中无铅焊点的微机械特性
作者:
Jules Samuel
;
Ryckelynck David
;
Duhamel Cecilie
;
Bienvenu Yves
;
Bisson Jean-Francois
;
Leon Renan
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Copper;
Lead;
Materials;
Numerical models;
Soldering;
Strain;
Tensile stress;
Lead-free solder;
finite element;
inverse method;
material properties;
parameter identification;
power electronic;
92.
Piranha Pin-Fins (PPF): Voracious boiling heat transfer by vapor venting from microchannels - system calibration and single-phase fluid dynamics
机译:
食人鱼Pin-Fins(PPF):通过微通道中的蒸汽排放实现沸腾沸腾传热-系统校准和单相流体动力学
作者:
Woodcock Corey
;
Houshmand Farzad
;
Plawsky Joel
;
Izenson Michael
;
Fogg David
;
Hill Roger
;
Phillips Scott
;
Peles Yoav
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Arrays;
Fluids;
Friction;
Heat sinks;
Pins;
Silicon;
Transducers;
CFD;
boiling;
cooling;
friction factor;
microfabrication;
microfluidics;
pin-fin;
velocimetry;
93.
A parametric study of Microporous Metal Matrix-Phase Change Material composite heat spreaders for transient thermal applications
机译:
用于瞬态热应用的微孔金属基质相变材料复合散热器的参数研究
作者:
Lingamneni Srilakshmi
;
Asheghi Mehdi
;
Goodson Kenneth E.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Aluminum;
Conductivity;
Copper;
Heating;
Phase change materials;
Thermal conductivity;
Composite heat spreader;
effective thermal conductivity;
microporous metal matrix;
phase change material;
transient cooling;
94.
Data center cold aisle set point optimization through total operating cost modeling
机译:
通过总运营成本建模优化数据中心冷通道设定点
作者:
Rubenstein Brandon
;
Faist Matthew
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Equations;
Fans;
Maintenance engineering;
Mathematical model;
Power demand;
Servers;
Temperature distribution;
conditions;
cost modeling;
datacenter;
operating;
operational;
reliability;
setpoint;
95.
Fatigue life prediction for solder interconnects in IGBT modules by using the successive initiation method
机译:
连续启动法预测IGBT模块中焊料互连的疲劳寿命
作者:
Ghodke Nilesh
;
Kumbhakarna Dipesh
;
Nakanekar Satej
;
Tonapi Sandeep
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Creep;
Finite element analysis;
Insulated gate bipolar transistors;
Load modeling;
Mathematical model;
Plastics;
Silicon;
Energy partitioning model;
Finite element analysis;
IGBT;
Successive initiation technique;
96.
Experimental characterization of Digitized Heat Transfer in circular microchannels
机译:
圆形微通道中数字化传热的实验表征
作者:
Zhang Peter
;
Mohseni Kamran
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Heating;
Q measurement;
Time measurement;
Viscosity;
97.
Wafer-level packaging method incorporating embedded thermal management for GaN-based RF front-ends
机译:
晶圆级封装方法,结合嵌入式热管理技术,用于GaN基RF前端
作者:
Margomenos A.
;
Herrault F.
;
Prophet E.
;
Micovic M.
;
Yajima M.
;
Butler C.
;
Shinohara K.
;
Brown D.F.
;
Corrion A.
;
Kurdoghlian A.
;
Bowen R.
;
Wetzel M.
;
McGuire C.
;
Grabar R.
;
Chow D.H.
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Gallium nitride;
Heat sinks;
Heat transfer;
Heating;
Logic gates;
Radio frequency;
Substrates;
Gallium nitride;
packaging;
power amplifiers;
thermal management;
98.
Understanding the impact of temperature variations on measurement of stress dependent parameters of bipolar junction transistors
机译:
了解温度变化对双极结型晶体管应力相关参数的测量的影响
作者:
Hussain Safina
;
Jaeger Richard C.
;
Suhling Jeffrey C.
;
Wilamowski Bogdan M.
;
Hamilton Michael C.
;
Gnanachchelvi Parameshwaran
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Current measurement;
Silicon;
Stress;
Strips;
Temperature measurement;
Transistors;
Voltage measurement;
BJT;
Bipolar Transistor;
Current Gain;
Deformation Potential;
Four Point Bending;
Piezoresistance;
Strain;
Stress;
99.
The application of through silicon vias (or TSVs) for high power and temperature devices
机译:
硅通孔(或TSV)在高功率和高温设备中的应用
作者:
Ranade Ajinkya P.
;
Havens Ross
;
Srihari Krishnaswami
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Packaging;
Silicon;
Stacking;
Stress;
Thermomechanical processes;
Three-dimensional displays;
Through-silicon vias;
2.5D and 3D integration;
TSV;
high power and high temperature application;
thermo-mechanical analysis;
100.
A review of LED technology trends and relevant thermal management strategies
机译:
回顾LED技术趋势和相关的热管理策略
作者:
Pryde James R.
;
Whalley David.C.
;
Malalasekera Weeratunge
会议名称:
《Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2014年
关键词:
Industries;
Light emitting diodes;
Light sources;
Lighting;
Market research;
Materials;
Thermal management;
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