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METHOD FOR THIN FILM ENCAPSULATION (TFE) OF A MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICE AND THE MEMS DEVICE ENCAPSULATED THEREOF
METHOD FOR THIN FILM ENCAPSULATION (TFE) OF A MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICE AND THE MEMS DEVICE ENCAPSULATED THEREOF
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机译:微机电系统(MEMS)器件的薄膜封装(TFE)的方法及其封装的MEMS器件
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摘要
A method for thin film encapsulation (TFE) of a microelectromechanical system (MEMS) device, including providing a substrate; forming a MEMS device on the substrate; forming one or more etching channels adjacent to the MEMS device; providing one or more cavities below the MEMS device; and forming one or more cavities above the MEMS device.
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