Method For Thin Film Encapsulation (TFE) Of A Microelectromechanical System (MEMS) Device And The MEMS Device Encapsulated Thereof

摘要

A method for thin film encapsulation (TFE) of a microelectromechanical system (MEMS) device, including providing a substrate; forming a MEMS device on the substrate; forming one or more etching channels adjacent to the MEMS device; providing one or more cavities below the MEMS device; and forming one or more cavities above the MEMS device.