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Trench isolation MOS P-N junction diode device and method for manufacturing the same

机译:沟槽隔离MOS P-N结二极管器件及其制造方法

摘要

A trench isolation metal-oxide-semiconductor (MOS) P-N junction diode device and a manufacturing method thereof are provided. The trench isolation MOS P-N junction diode device is a combination of an N-channel MOS structure and a lateral P-N junction diode, wherein a polysilicon-filled trench oxide layer is buried in the P-type structure to replace the majority of the P-type structure. As a consequence, the trench isolation MOS P-N junction diode device of the present invention has the benefits of the Schottky diode and the P-N junction diode. That is, the trench isolation MOS P-N junction diode device has rapid switching speed, low forward voltage drop, low reverse leakage current and short reverse recovery time.
机译:提供了一种沟槽隔离金属氧化物半导体P-N结二极管器件及其制造方法。沟槽隔离MOS PN结二极管器件是N沟道MOS结构和横向PN结二极管的组合,其中,多晶硅填充的沟槽氧化物层埋在P型结构中,以取代大多数P型结构结构体。结果,本发明的沟槽隔离MOS P-N结二极管器件具有肖特基二极管和P-N结二极管的优点。即,沟槽隔离MOS P-N结二极管器件具有快速的开关速度,低的正向压降,低的反向漏电流和短的反向恢复时间。

著录项

  • 公开/公告号US9029235B2

    专利类型

  • 公开/公告日2015-05-12

    原文格式PDF

  • 申请/专利权人 PFC DEVICE CORP.;

    申请/专利号US201414287173

  • 申请日2014-05-26

  • 分类号H01L21/76;H01L21/336;H01L29/812;H01L21/8249;H01L29/76;H01L21/762;H01L29/66;H01L29/861;H01L21/761;H01L29/80;H01L29/94;

  • 国家 US

  • 入库时间 2022-08-21 15:21:50

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