首页> 外国专利> TRENCH ISOLATION MOS P-N JUNCTION DIODE DEVICE AND METHOD FOR MANUFACTURING THE SAME

TRENCH ISOLATION MOS P-N JUNCTION DIODE DEVICE AND METHOD FOR MANUFACTURING THE SAME

机译:沟槽隔离MOS P-N结二极管装置及其制造方法

摘要

A trench isolation metal-oxide-semiconductor (MOS) P-N junction diode device and a manufacturing method thereof are provided. The trench isolation MOS P-N junction diode device is a combination of an N-channel MOS structure and a lateral P-N junction diode, wherein a polysilicon-filled trench oxide layer is buried in the P-type structure to replace the majority of the P-type structure. As a consequence, the trench isolation MOS P-N junction diode device of the present invention has the benefits of the Schottky diode and the P-N junction diode. That is, the trench isolation MOS P-N junction diode device has rapid switching speed, low forward voltage drop, low reverse leakage current and short reverse recovery time.
机译:提供了一种沟槽隔离金属氧化物半导体P-N结二极管器件及其制造方法。沟槽隔离MOS PN结二极管器件是N沟道MOS结构和横向PN结二极管的组合,其中,多晶硅填充的沟槽氧化物层埋在P型结构中,以取代大多数P型结构结构体。结果,本发明的沟槽隔离MOS P-N结二极管器件具有肖特基二极管和P-N结二极管的优点。即,沟槽隔离MOS P-N结二极管器件具有快速的开关速度,低的正向压降,低的反向漏电流和短的反向恢复时间。

著录项

  • 公开/公告号US2014004681A1

    专利类型

  • 公开/公告日2014-01-02

    原文格式PDF

  • 申请/专利权人 PFC DEVICE CORP.;

    申请/专利号US201314018627

  • 申请日2013-09-05

  • 分类号H01L21/761;

  • 国家 US

  • 入库时间 2022-08-21 16:02:49

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