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Wide Band Gap Semiconductor Wafers Grown and processed in a Microgravity Environment and Method of Production

机译:在微重力环境中生长和加工的宽带隙半导体晶圆及其生产方法

摘要

Wide band gap semiconductor wafers with previously unattainable characteristics and the method of processing and producing the same are disclosed and claimed herein. Specifically, the application discloses and claims a method to process silicon carbide and other similar wide band gap semiconductors in a microgravity environment. The wafers are placed onto stackable containment systems that create an appropriate gap between each wafer to allow for homogeneous heating and processing. The resulting wide band gap semiconductors have unique molecular structures not attainable when wide band gap semiconductors with the identical chemical composition are produced in a standard 1 gravity environment.
机译:本文公开并要求保护具有先前无法获得的特性的宽带隙半导体晶片及其处理和生产方法。具体地,本申请公开并要求保护一种在微重力环境中处理碳化硅和其他类似宽带隙半导体的方法。晶片被放置在可堆叠的容纳系统上,该可堆叠的容纳系统在每个晶片之间产生适当的间隙以允许均匀加热和处理。当在标准1重力环境下生产具有相同化学组成的宽带隙半导体时,所得宽带隙半导体具有无法获得的独特分子结构。

著录项

  • 公开/公告号US2014353682A1

    专利类型

  • 公开/公告日2014-12-04

    原文格式PDF

  • 申请/专利权人 WILLIAM F. SENG;RICHARD L. GLOVER;

    申请/专利号US201313904918

  • 发明设计人 WILLIAM F. SENG;RICHARD L. GLOVER;

    申请日2013-05-29

  • 分类号C30B30/08;C30B9/00;C30B7/00;H01L21/02;H01L29/16;

  • 国家 US

  • 入库时间 2022-08-21 15:21:47

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