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Requirements of short-circuit detection methods and turn-off for wide band gap semiconductors

机译:宽带隙半导体的短路检测方法和关断的要求

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This paper adds some new results on the short circuit (SC) robustness of novel wide bandgap (WBG) devices presented in [1-3] for 1.2 kV SiC MOSFETs but also for other voltage classes relevant for traction application. Also different short-circuit (SC) detection methods will be evaluated with regard to their application in traction converters using either conventional Si-based or novel WBG semiconductors. In order to derive the necessary requirements for the best suitable SC detection method the SC robustness of silicon based IGBTs, planar SiC MOSFETs and GaN HEMT was evaluated. For this comparison commercially available devices of different voltage classes ranging from 600 V to 1.7 kV are measured under SC type one in order to find the critical energy, which will destroy the device. The mechanisms of failure were also analysed. Together with further criteria like the gate-oxide stability different SC detection methods are evaluated with regard to whether they meet the derived detection requirements of WBG devices.
机译:本文在[1-3]中针对1.2 kV SiC MOSFET以及与牵引应用相关的其他电压等级的新型宽带隙(WBG)器件的短路(SC)鲁棒性方面,添加了一些新的结果。对于使用传统的基于硅或新型WBG半导体的牵引转换器中的应用,还将评估不同的短路(SC)检测方法。为了得出最合适的SC检测方法的必要要求,对硅基IGBT,平面SiC MOSFET和GaN HEMT的SC鲁棒性进行了评估。为了进行此比较,在SC类型1下测量了范围从600 V到1.7 kV的不同电压等级的市售设备,以找到将破坏设备的临界能量。还分析了故障的机理。结合栅氧化稳定性等其他标准,评估了不同的SC检测方法是否满足WBG器件的检测要求。

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