The invention relates to a carrier element comprising a connection to a heat source and a connection to a heat sink and a thermoelectric thin-film element which is arranged on the carrier element between the connection to the heat source and the connection to the heat sink and has a hot side and a cold side, wherein the hot side is connected to the connection to the heat source in a thermally conductive manner and the cold side is connected to the connection to the heat sink in a thermally conductive manner. In order to avoid harmful tensile and shear stresses in the thermoelectric thin-film element, in particular in the thermoelectrically active material, with good thermal connection to a heat source and a heat sink, it is proposed that at least one elastic and/or flexible compensation section of the carrier element is set up between the connection to the heat source and the connection to the heat sink in such a manner that said section compensates for different expansions of the heat source and of the heat sink by virtue of the shape of the compensation section being changed.
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