Ball supplier and solder ball bumping method using the same

摘要

The present invention discloses a ball feeder for supplying solder balls to the top of a ball mask in solder ball inflation equipment. A ball supply device according to the present invention includes: a ball supply cylinder having a plurality of through holes through which solder balls can pass; A ball reservoir coupled to the ball dispenser and containing a solder ball to be supplied into the ball dispenser; And horizontal driving means for horizontally moving the ball supply cylinder above the ball mask. According to the present invention, it is possible to automate the supply of the solder balls in the solder ball bumping process and to easily remove the residual solder balls, thereby greatly improving the productivity of the ball bumping process. In addition, since the brush is not used, it is possible to prevent work defects.