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ARRAY-TYPE MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT, BOARD FOR MOUNTING THE SAME AND METHOD OF MANUFACTURING THE SAME
ARRAY-TYPE MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT, BOARD FOR MOUNTING THE SAME AND METHOD OF MANUFACTURING THE SAME
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机译:阵列式多层陶瓷电子元件,其安装板及制造方法
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摘要
The present invention provides an array type multi-layered ceramic electronic component to minimize the area for mounting a plurality of multi-layered ceramic electronic components on one board and to reduce the area of the board by including: a ceramic body on which a plurality of dielectric layers are stacked up in the longitudinal direction; a first capacitor unit which includes first and second internal electrodes which are alternatedly exposed through both side surfaces of the ceramic body while having the dielectric layers in between; a second capacitor unit which is separated apart from the first capacitor unit in the longitudinal direction and includes third and fourth internal electrode which are alternatedly exposed through the both side surfaces of the ceramic body while having the dielectric layers in between; a first external electrode which is formed in one side surface of the ceramic body and is connected to one exposed end of the first and second internal electrodes; a second external electrode which is separated apart from the first external electrode in the longitudinal direction, is formed in one side surface of the ceramic body and is connected to one end of the third and fourth internal electrodes; and a third external electrode which is formed on the other side surface of the ceramic body and serially connects the other exposed end of the first and second internal electrode with the other exposed end of the third and fourth internal electrodes.
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