Highly manufacturable multi-layered ceramic surface mounted package

摘要

A surface mount package was designed in 1983 to satisfy a multi-chip cost-performance market requirement where a large number of components can be replaced with a few integrated devices in a single package. It was decided to use the IBM multi-layer ceramic (MLC) technology for the carrier substrate because of proven reliability, volume manufacturing capacity, multi-chip capability, wiring flexibility, and performance. Second, it was decided to use a specially designed surface-mount technology (SMT) interconnection to the card instead of the industry standard SMT or pin in hole because of I/O density, cost, and performance. The SMT interconnection was refined through theoretical and empirical investigation along with the low cost, high manufacturability requirement. The result was a high melting point Sn/Pb ball placed in a 0.50" grid array attached to the substrate and card using eutectic solder. Design concepts to aid in manufacturing are discussed together with the manufacturing/process design, and a typical example of this packaging technology is presented.