首页> 外国专利> ARRAY-TYPE MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT, MOUNTING STRUCTURE OF CIRCUIT HAVE THEREON ARRAY-TYPE MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

ARRAY-TYPE MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT, MOUNTING STRUCTURE OF CIRCUIT HAVE THEREON ARRAY-TYPE MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

机译:阵列式多层陶瓷电子元件,其电路的安装结构具有阵列式多层陶瓷电子元件及其制造方法

摘要

Provided in the present invention is an array-type laminated ceramic electronic part which comprises a ceramic body in which multiple dielectric layers are laminated; multiple first and second external electrodes separately formed in the longitudinal direction at one side of the ceramic body and the other side facing one side of the ceramic body; and multiple internal electrode laminated parts formed inside the ceramic body to be opposite to each other, and having multiple first and second internal electrodes connected to the first and second external electrodes, wherein some of the internal electrode laminated parts have different laminated numbers of the first and second internal electrodes from the laminated numbers of remaining internal electrode laminated parts.
机译:本发明提供一种阵列型层叠陶瓷电子部件,其包括层叠有多个电介质层的陶瓷体。多个第一和第二外部电极沿纵向分别形成在陶瓷体的一侧和面对陶瓷体的一侧的另一侧。多个内部电极层叠部在陶瓷体内形成为彼此相对,并具有与第一外部电极和第二外部电极连接的多个第一内部电极和第二内部电极,其中,内部电极层叠部中的一些内部电极层叠部的层叠数不同。第二内部电极由剩余的内部电极层叠部的层叠数构成。

著录项

  • 公开/公告号KR20140065255A

    专利类型

  • 公开/公告日2014-05-29

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRO-MECHANICS CO. LTD.;

    申请/专利号KR20120132552

  • 发明设计人 KWAG JOON HWAN;

    申请日2012-11-21

  • 分类号H01G4/12;H01G2/06;

  • 国家 KR

  • 入库时间 2022-08-21 15:42:55

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