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ARRAY-TYPE MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT, MOUNTING STRUCTURE OF CIRCUIT HAVE THEREON ARRAY-TYPE MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
ARRAY-TYPE MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT, MOUNTING STRUCTURE OF CIRCUIT HAVE THEREON ARRAY-TYPE MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
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机译:阵列式多层陶瓷电子元件,其电路的安装结构具有阵列式多层陶瓷电子元件及其制造方法
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摘要
Provided in the present invention is an array-type laminated ceramic electronic part which comprises a ceramic body in which multiple dielectric layers are laminated; multiple first and second external electrodes separately formed in the longitudinal direction at one side of the ceramic body and the other side facing one side of the ceramic body; and multiple internal electrode laminated parts formed inside the ceramic body to be opposite to each other, and having multiple first and second internal electrodes connected to the first and second external electrodes, wherein some of the internal electrode laminated parts have different laminated numbers of the first and second internal electrodes from the laminated numbers of remaining internal electrode laminated parts.
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