COMPOSITE FOR LEAD-FREE SOLDER ALLOY, LEAD-FREE SOLDER PASTE INCLUDING THE SAME AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

摘要

The present invention relates to a composition for lead-free solder alloy, to lead-free solder paste including the same and to a semiconductor package including the same. The composition for lead-free solder alloy according to the present invention can improve the mechanical strength, thermal strength and acceleration impact performance greatly by including indium in an optimal composition except for tin, silver and copper, thereby having excellent bonding characteristics to a bonding base material compared with the traditionally used alloy composition of tin, silver and copper. Accordingly, thermal impact performance and acceleration impact performance can be improved simultaneously by applying the lead-free solder alloy according to the present invention to electronic devices and printed circuit boards, particularly, substrates treated with Ni/Au, printed circuit boards treated with Ni/Au, substrates treated with Cu/OSP and printed circuit boards treated with Cu/OSP.