首页> 外国专利> ELECTRICALLY CONDUCTIVE LAMINATE STRUCTURES, ELECTRICAL INTERCONNECTS, AND METHODS OF FORMING ELECTRICAL INTERCONNECTS

ELECTRICALLY CONDUCTIVE LAMINATE STRUCTURES, ELECTRICAL INTERCONNECTS, AND METHODS OF FORMING ELECTRICAL INTERCONNECTS

机译:导电叠层结构,电气互连件以及形成电气互连件的方法

摘要

Some embodiments include electrical interconnects. The interconnects may contain laminate structures having a graphene region sandwiched between non-graphene regions. In some embodiments the graphene and non-graphene regions may be nested within one another. In some embodiments an electrically insulative material may be over an upper surface of the laminate structure, and an opening may extend through the insulative material to a portion of the laminate structure. Electrically conductive material may be within the opening and in electrical contact with at least one of the non-graphene regions of the laminate structure. Some embodiments include methods of forming electrical interconnects in which non-graphene material and graphene are alternately formed within a trench to form nested non- graphene and graphene regions.
机译:一些实施例包括电互连。互连可以包含具有夹在非石墨烯区域之间的石墨烯区域的层压结构。在一些实施例中,石墨烯和非石墨烯区域可以彼此嵌套。在一些实施例中,电绝缘材料可以在层压结构的上表面之上,并且开口可以延伸穿过绝缘材料到达层压结构的一部分。导电材料可以在开口内并且与层压结构的非石墨烯区域中的至少一个电接触。一些实施例包括形成电互连的方法,其中在沟槽内交替地形成非石墨烯材料和石墨烯以形成嵌套的非石墨烯和石墨烯区域。

著录项

  • 公开/公告号KR20150096528A

    专利类型

  • 公开/公告日2015-08-24

    原文格式PDF

  • 申请/专利权人 MICRON TECHNOLOGY INC.;

    申请/专利号KR20157020975

  • 发明设计人 SANDHU GURTEJ S.;

    申请日2011-06-07

  • 分类号H01L23/532;C01B31/04;H01L21/768;

  • 国家 KR

  • 入库时间 2022-08-21 14:59:24

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