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Wafer contacting a direction and arrangement and method for the electrochemical etching of a wafer
Wafer contacting a direction and arrangement and method for the electrochemical etching of a wafer
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机译:晶片接触方向,用于晶片的电化学蚀刻的装置和方法
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摘要
A wafer contacting a direction, comprises: a pickup area (30), which is configured to receive a wafer; and an elastically deformable support (50), which in the pickup area (30) is arranged and an electrically conductive surface area (8) contains.
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