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Wafer contacting device, and arrangement and method for electrochemical etching of a wafer
Wafer contacting device, and arrangement and method for electrochemical etching of a wafer
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机译:晶片接触装置以及用于晶片的电化学蚀刻的装置和方法
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摘要
A wafer contacting device may include: a receiving region configured to receive a wafer; and an elastically deformable carrier disposed in the receiving region and including an electrically conductive surface region.
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