首页>
外国专利>
WAFER CONTACTING DEVICE, AND ARRANGEMENT AND METHOD FOR ELECTROCHEMICAL ETCHING OF A WAFER
WAFER CONTACTING DEVICE, AND ARRANGEMENT AND METHOD FOR ELECTROCHEMICAL ETCHING OF A WAFER
展开▼
机译:晶片接触装置,以及晶片的电化学刻蚀的布置和方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
A wafer contacting device may include: a receiving region configured to receive a wafer; and an elastically deformable carrier disposed in the receiving region and including an electrically conductive surface region.
展开▼