首页> 外国专利> MULTI-PIECE WIRING SUBSTRATE, MANUFACTURING METHOD OF MULTI-PIECE WIRING SUBSTRATE

MULTI-PIECE WIRING SUBSTRATE, MANUFACTURING METHOD OF MULTI-PIECE WIRING SUBSTRATE

机译:多层配线基板,多层配线基板的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a multi-piece wiring substrate capable of suppressing warp from occurring, and a manufacturing method of a multi-piece wiring substrate.;SOLUTION: A multi-piece wiring substrate according to the present invention includes: a product region made of ceramic and in which, in a plan view, a plurality of rectangular wiring substrate parts are arranged so as to be horizontally and vertically adjacent to each other; and an ear part similarly made of ceramic, has a shape of rectangular frame in a plan view, and positioned on the periphery of the product region. Further, in the ear part, a bent part is formed by bending the ear part having the rectangular frame shape along each side thereof.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2016,JPO&INPIT
机译:解决的问题:提供一种能够抑制翘曲的发生的多层布线基板以及该多层布线基板的制造方法。解决方案:本发明的多层布线基板包括:产品由陶瓷制成的区域,在平面图中,多个矩形布线基板部分在水平和垂直方向上彼此相邻地布置;耳部类似地由陶瓷制成,在平面图中具有矩形框的形状,并且位于产品区域的外围。另外,在耳朵部分中,通过沿其两侧弯曲具有矩形框架形状的耳朵部分而形成弯曲部分。选图:图1;版权:(C)2016,JPO&INPIT

著录项

  • 公开/公告号JP2016111281A

    专利类型

  • 公开/公告日2016-06-20

    原文格式PDF

  • 申请/专利权人 NGK SPARK PLUG CO LTD;

    申请/专利号JP20140249642

  • 发明设计人 KUROSAWA NORIA;HASEGAWA MASAMI;

    申请日2014-12-10

  • 分类号H05K1/02;H05K3/00;

  • 国家 JP

  • 入库时间 2022-08-21 14:46:05

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号