MULTI-PIECE WIRING SUBSTRATE, MANUFACTURING METHOD OF MULTI-PIECE WIRING SUBSTRATE
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机译:多层配线基板,多层配线基板的制造方法
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摘要
PROBLEM TO BE SOLVED: To provide a multi-piece wiring substrate capable of suppressing warp from occurring, and a manufacturing method of a multi-piece wiring substrate.;SOLUTION: A multi-piece wiring substrate according to the present invention includes: a product region made of ceramic and in which, in a plan view, a plurality of rectangular wiring substrate parts are arranged so as to be horizontally and vertically adjacent to each other; and an ear part similarly made of ceramic, has a shape of rectangular frame in a plan view, and positioned on the periphery of the product region. Further, in the ear part, a bent part is formed by bending the ear part having the rectangular frame shape along each side thereof.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2016,JPO&INPIT
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