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Method for monitoring the operation state of the surface inspection system for detecting defects on a surface of a semiconductor wafer

机译:监视用于检测半导体晶片表面上的缺陷的表面检查系统的操作状态的方法

摘要

The operational state of a surface inspection system for detecting defects on the surface of semiconductor wafers is monitored by: providing a reference wafer having defects of a particular number, size, and density on an examination surface; conducting a reference inspection of the reference wafer and at least one control inspection of the reference wafer by the surface inspection system, the position and size of defects on the examination surface being measured; identifying defects which, because of their position, are regarded as common defects of the reference inspection and of the control inspection; for each common defect, determining a size difference obtained from comparing its size from the reference inspection and from the control inspection; and assessing the operational state of the surface inspection system on the basis of the size differences.
机译:用于检测半导体晶片表面上的缺陷的表面检查系统的操作状态通过以下方法来监控:在检查表面上提供具有特定数量,尺寸和密度的缺陷的参考晶片;通过表面检查系统对参考晶片进行参考检查,并对参考晶片进行至少一次控制检查,并测量检查表面上缺陷的位置和大小;识别由于其位置而被视为参考检查和对照检查的常见缺陷的缺陷;对于每个常见缺陷,确定通过比较参考检验和对照检验的尺寸而获得的尺寸差;并根据尺寸差异评估表面检查系统的运行状态。

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