OPENING METHOD OF PLASTIC MOLDED SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE AND OPENING DEVICE OF PLASTIC MOLDED SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide plastic mold opening method and opening deice for opening a semiconductor device molded of plastic.SOLUTION: In a plastic mold opening method for opening a semiconductor device molded of plastic, the molded semiconductor device is opened using a chemical where a metal is fused into a liquid containing an acid. Consequently, a metal such as a bonding wire used in a package substrate can be prevented from being damaged by a chemical used for opening.SELECTED DRAWING: Figure 1