IGBT DEVICE AND METHOD FOR PACKAGING WHOLE-WAFER IGBT CHIP

摘要

An IGBT device and a method for packaging a whole-wafer IGBT chip. The IGBT device comprises: an entire wafer IGBT chip, the upper surface thereof comprising a central gate connection zone and a plurality of emitter connection zones surrounding the central gate connection zone, and the lower surface thereof comprising a collecting zone, wherein the emitter connection zones located on the surface of a failure cellular zone of the chip are thinned; a collector washer which is fixed on the lower surface of the chip, and an emitter washer which is fixed on the upper surface of the chip; a collector electrode which is electrically contacted with the collector washer, and an emitter electrode which is electrically contacted with the emitter washer; and a gate leading wire which is connected to the central gate connection zone.