首页>
外国专利>
Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch process
Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch process
展开▼
机译:使用自适应光学控制的激光划片工艺和等离子蚀刻工艺的混合晶圆切割方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of dicing a semiconductor wafer having a plurality of integrated circuits involves forming a mask above the semiconductor wafer, the mask composed of a layer covering and protecting the integrated circuits. The mask is then patterned with an adaptive optics-controlled laser scribing process to provide a patterned mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then plasma etched through the gaps in the patterned mask to singulate the integrated circuits.
展开▼