A microelectronic package may include a substrate (40) having first and second regions (46,48), a first surface (42) and a second surface (44) remote from the first surface; at least one microelectronic element (18) overlying the first surface (42) within the first region (46); electrically conductive elements (52) at the first surface within the second region (48); a support structure (20) having a third surface (24) and a fourth surface (22) remote from the third surface and overlying the first surface (42) within the second region (48) in which the third surface (42) faces the first surface (42), second and third electrically conductive elements (28, 26) exposed respectively at the third and fourth surfaces and electrically connected to the conductive elements (52) at the first surface (42) in the first region; and wire bonds (14) defining edge surfaces (36) and having bases (32) electrically connected through ones of the third conductive elements (26) to respective ones of the second conductive elements (28) and ends (34) remote from the support structure and the bases.
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