首页>
外国专利>
STEALTH DICING OF WAFERS HAVING WAFER-LEVEL UNDERFILL
STEALTH DICING OF WAFERS HAVING WAFER-LEVEL UNDERFILL
展开▼
机译:晶圆水平装满的晶圆的秘密切块
展开▼
页面导航
摘要
著录项
相似文献
摘要
Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of dicing a wafer involves providing a semiconductor wafer having integrated circuits on a front side thereof, and having a wafer-level underfill material layer disposed on the integrated circuits. The method also involves laser irradiating the semiconductor wafer from a backside of the semiconductor wafer to generate defects along dicing streets of the semiconductor wafer, the dicing streets oriented between the integrated circuits. The method also involves, subsequent to the laser irradiating, mechanically singulating the integrated circuits along the dicing streets.
展开▼