The invention refers to a system (20) for cooling a pre-laminated printed circuit board in transit between a pre-laminator (4) and a laminator (6). The cooling system comprises: a conditioner (21) suitable for thermally conditioning ambient air, bringing it to a temperature preferably comprised between 8 °C and 12 °C, a distributor (22) communicating with the conditioner and suitable for creating a flow of conditioned air, at a substantially laminar condition, that hits the pre-laminated board, a filter (26) of HEPA type housed in the distributor, a thermocouple (27) for detecting the temperature of the conditioned air at the outlet of the distributor, and a control device (28) connected with the thermocouple and the conditioner for commanding the actuation thereof. In particular, the control device commands the actuation of the conditioner in a manner so as to bring and maintain the temperature of the conditioned air at the outlet of the distributor to/at value that is as close as possible to a predefined temperature. The invention also refers to a module (1) for conveying a pre-laminated printed circuit board from a pre-laminator (4) to a laminator (6), comprising the cooling system (20) that is the subject of the invention.
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