Integrated Printed Circuit Board (PCB) Active Cooling With Piezoelectric Actuator.

摘要

Thermal management is challenging in Radio Frequency (RF) communication and radar systems that require high-power levels for operation and reliability as well as small footprints to control intrinsic losses and meet design constraints. An interesting approach uses discrete, in-situ fluid handling and embedded synthetic jet drivers to enhance local cooling at the component. In this approach, fluid cavities and actuators are integrated into the Printed Circuit Board (PCB) near the component. Magnetic and piezoelectric actuators have proven effective in other less demanding applications. The challenge to adapting from magnetic to piezoelectric actuators is to achieve high flow rates because piezoelectric actuators have lower displacement and higher frequencies. This investigation explored frequency and displacement effects on cooling rates for piezoelectric actuators embedded in PCB. Further concept development includes integration with thermal ground planes.