A PCB(Printed Circuit Board), a PCB card using the PCB, and methods for manufacturing the PCB and the PCB card are provided to implement a high density circuit pattern without an additional plating lead-in wire for forming a circuit pattern. A method for manufacturing a PCB(100) includes the steps of: stacking an insulating member(120) on a base; forming at least one contact unit(130) on the insulating member, wherein a surface of at least one contact unit contacts with the base; and forming a circuit pattern(140) on the insulating member, wherein an end of the circuit pattern is connected to the contact unit. The method for manufacturing the PCB further includes a step of removing the base. The insulating member is made of thermosetting resin and is stacked on the base through heat fusion.
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