首页> 外国专利> PRINTED CIRCUIT BOARD, PCB CARD USING THE PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE PRINTED CIRCUIT BOARD AND THE PCB CARD

PRINTED CIRCUIT BOARD, PCB CARD USING THE PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE PRINTED CIRCUIT BOARD AND THE PCB CARD

机译:印刷电路板,使用该印刷电路板的印刷电路板卡,制造印刷电路板的方法和印刷电路板卡

摘要

A PCB(Printed Circuit Board), a PCB card using the PCB, and methods for manufacturing the PCB and the PCB card are provided to implement a high density circuit pattern without an additional plating lead-in wire for forming a circuit pattern. A method for manufacturing a PCB(100) includes the steps of: stacking an insulating member(120) on a base; forming at least one contact unit(130) on the insulating member, wherein a surface of at least one contact unit contacts with the base; and forming a circuit pattern(140) on the insulating member, wherein an end of the circuit pattern is connected to the contact unit. The method for manufacturing the PCB further includes a step of removing the base. The insulating member is made of thermosetting resin and is stacked on the base through heat fusion.
机译:提供了PCB(印刷电路板),使用该PCB的PCB卡以及用于制造该PCB和PCB卡的方法,以实现高密度电路图案,而无需用于形成电路图案的额外的电镀引入线。一种用于制造PCB(100)的方法,包括以下步骤:在基底上堆叠绝缘构件(120);以及将绝缘构件(120)堆叠在基底上。在绝缘构件上形成至少一个接触单元(130),其中至少一个接触单元的表面与基底接触;在绝缘构件上形成电路图案(140),其中电路图案的一端连接到接触单元。用于制造PCB的方法还包括移除基底的步骤。绝缘构件由热固性树脂制成,并且通过热熔堆叠在基底上。

著录项

  • 公开/公告号KR101251660B1

    专利类型

  • 公开/公告日2013-04-05

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20060091445

  • 发明设计人 이광태;이성규;강규동;

    申请日2006-09-20

  • 分类号H05K3;H01R12;

  • 国家 KR

  • 入库时间 2022-08-21 16:25:23

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