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ADHESIVE RESIN FOR DICING DIE-BONDING FILM, ATTACH FILM FOR DICING DIE-BONDING FILM INCLUDING THE SAME AND DICING DIE-BONDING FILM INCLUDING THE SAME
ADHESIVE RESIN FOR DICING DIE-BONDING FILM, ATTACH FILM FOR DICING DIE-BONDING FILM INCLUDING THE SAME AND DICING DIE-BONDING FILM INCLUDING THE SAME
The present invention relates to an adhesive resin for a dicing die-bonding film, an adhesive film for a dicing die-bonding film comprising the same, and a dicing die-bonding film. The adhesive resin, the adhesive film, and the dicing die-bonding film of the present invention show excellent reliability such as thermal resistance, moisture resistance, and reflow crack resistance.
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