首页> 外国专利> ADHESIVE RESIN FOR DICING DIE-BONDING FILM, ATTACH FILM FOR DICING DIE-BONDING FILM INCLUDING THE SAME AND DICING DIE-BONDING FILM INCLUDING THE SAME

ADHESIVE RESIN FOR DICING DIE-BONDING FILM, ATTACH FILM FOR DICING DIE-BONDING FILM INCLUDING THE SAME AND DICING DIE-BONDING FILM INCLUDING THE SAME

机译:用于模切模切胶片的胶粘树脂,用于模切包括相同模切胶片的粘合膜和用于模切包括相同模切胶片的粘合膜的粘合膜

摘要

The present invention relates to an adhesive resin for a dicing die-bonding film, an adhesive film for a dicing die-bonding film comprising the same, and a dicing die-bonding film. The adhesive resin, the adhesive film, and the dicing die-bonding film of the present invention show excellent reliability such as thermal resistance, moisture resistance, and reflow crack resistance.
机译:切割芯片接合薄膜用粘合树脂,切割芯片接合薄膜用粘合薄膜以及切割芯片接合薄膜技术领域本发明涉及一种切割芯片接合薄膜用粘合树脂,包括其的切割芯片接合薄膜的粘合薄膜以及切割芯片接合薄膜。本发明的粘合树脂,粘合膜和切割/芯片接合膜显示出优异的可靠性,例如耐热性,耐湿性和耐回流裂纹性。

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