DICING DIE-BONDING FILM INCLUDING PRESSURE-SENSITIVE ADHESIVE LAYER AND DIE-BONDING ADHESIVE LAYER, METHOD OF FIXING CHIPPED WORK, AND SEMICONDUCTOR DEVICE THEREOF

摘要

PURPOSE: A dicing die-bonding film including a pressure-sensitive adhesive layer and a die-bonding adhesive layer, a method of fixing chipped work, and a semiconductor device thereof are provided to prevent contamination of a dicing ring and prevent simultaneously chip scattering during a dicing process. CONSTITUTION: A dicing die-bonding film includes a pressure-sensitive adhesive layer(2) formed on a supporting base material(1) and a die-bonding adhesive layer formed on the pressure-sensitive adhesive layer. The die-bonding adhesive layer is arranged as a work-attaching part(3a) on a part of the pressure-sensitive adhesive layer. The work-attaching part is larger than an area of a work surface. The work-attaching part is designed so as to be held within the inner diameter of a dicing ring stuck on the pressure-sensitive adhesive layer.