DICING/DIE-BONDING TAPE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP WITH PRESSURE-SENSITIVE ADHESIVE LAYER

摘要

PROBLEM TO BE SOLVED: To provide a dicing/die-bonding tape capable of accurately dicing a pressure-sensitive adhesive layer, and improving a pickup property of a semiconductor chip with a pressure-sensitive adhesive layer.;SOLUTION: A dicing/die-bonding tape 1 according to the present invention comprises: a pressure-sensitive layer 3; a substrate layer 4; and a dicing layer 5. In dicing, a dicing ring 26 is adhered on an outer peripheral portion of the dicing layer 5. The dicing layer 5 has an adhesion starting point 5C at the outer peripheral portion. When a portion of the dicing ring layer 5 adhered to the dicing ring 26 at a portion except for the adhesion starting point 5C is designated as W(mm), and an outside diameter of the dicing layer 5 at a portion except for the adhesion starting point 5C is designated as D(mm), length L (mm) of the adhesion starting point 5C at a position with a distance of 0.3 W(mm) inward from an outer peripheral tip on the adhesion starting point 5C side of the dicing layer 5 is within a range of 0.30 D-0.44 D(mm).;COPYRIGHT: (C)2013,JPO&INPIT