DICING/DIE-BONDING TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP PROVIDED WITH ADHESIVE LAYER

摘要

Provided is a dicing/die-bonding tape wherein peeling is smoothly performed at a peeling start point of a dicing layer at the time of obtaining a semiconductor chip that is provided with an adhesive layer.A dicing/die-bonding tape (1) relating to the present invention is provided with an adhesive layer (3), and a dicing layer (5), which is disposed on the one surface (3a) side of the adhesive layer (3), and which has a region protruding further toward the sides than the outer circumferential side surface of the adhesive layer (3), and at the time of performing dicing, a dicing ring is bonded to an outer circumferential portion of the dicing layer (5). The dicing layer (5) has, in an outer circumferential portion thereof, a bonding start point (5C) that is to be bonded to the dicing ring when starting the bonding, and the bonding start point (5C) of the dicing layer (5) is compressed in the thickness direction of the dicing layer (5).