Pressure-sensitive adhesive compositions, pressure-sensitive adhesive films, dicing die-bonding films and semiconductor wafers comprising the same

摘要

The present invention is a base resin; And a pressure-sensitive adhesive composition comprising a photochromic compound, a pressure-sensitive adhesive film, a dicing die-bonding film, and a semiconductor wafer produced using the same. The pressure-sensitive adhesive composition according to the present invention can be easily grasped whether or not the ultraviolet irradiation to the dicing film in the semiconductor packaging step by changing the color by irradiation such as ultraviolet rays. Accordingly, in the present invention, it is possible to provide an adhesive composition, an adhesive film, a dicing die bonding film, and a semiconductor wafer capable of reducing defects that may occur due to opacity of ultraviolet irradiation in a semiconductor packaging process.;Pressure-sensitive adhesive, pressure-sensitive adhesive composition, pressure-sensitive adhesive film, dicing die-bonding film, photochromic compound, photoinitiator, melting point