PRESSURE-SENSITIVE ADHESIVE COMPOSITIONS, PRESSURE-SENSITIVE ADHESIVE FILMS, DICING DIE-BONDING FILMS AND SEMICONDUCTOR WAFERS COMPRISING THE SAME

摘要

PURPOSE: A pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, a dicing die-bonding film and a semiconductor wafer containing the same are provided to grasp the irradiation of ultraviolet rays to a dicing film and to reduce inferiority. CONSTITUTION: A pressure-sensitive adhesive composition comprises a base resin and a photochromic composition. The base resin is an acrylic copolymer with an average molecular weight of 150,000 - 200,000. The acrylic copolymer comprises an acrylic acid ester-based monomer and a cross-linking functional group-containing monomer. An adhesive film includes an adhesive layer containing the pressure-sensitive adhesive composition.