Pressure-sensitive adhesive compositions, pressure-sensitive adhesive films, dicing die-bonding films and semiconductor wafers comprising the same

摘要

PURPOSE: A pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, a dicing die-bonding film and a semiconductor wafer comprising the same are provided to suppress the change of releasability of a dicing film and die-bonding film after a long-term storage at a room temperature or high temperature. CONSTITUTION: A pressure-sensitive adhesive composition comprises a base resin and a photoinitiator with a melting point of 70C. The base resin is an acrylic copolymer with average molecular weight with 200,000 -1,500,000. The acrylic copolymer includes an acrylic acid ester-based monomer and a cross-linkable functional group-containing monomer. An adhesive film includes an adhesive layer containing the adhesive composition.