Dicing die attach films

摘要

The Hysol QMI5100 and Hysol QMI5200 dicing die attach film products are designed to streamline the die attach process, particularly for stacked die applications. Hysol QMI5100's and Hysol QMI5200's formulations combine the properties and functions of die attach film and dicing tape into one product. With these dual-structured materials, one need only laminate the film to the backside of the wafer, dice the wafer, pick the die, and move to die placement.