Reaction-induced phase separation of epoxy resin/acrylic polymer alloy and its application to die-bonding film

摘要

Low-modulus die bonding adhesive films are useful for a chip size/scale package(CSP)which is suitable for compact electronic calculators with higher speed.In particular,to cope with their wide-spreading application of very thin semiconductor wafers and Pb-free solders,the films are expectedly to have both low viscosity in the attaching process and high reliability of bonding in the high temperature reflow process after curing.We studied the phase structure and the property of a new reaction-induced polymer alloy consisting of a low modulus acrylic polymer and a highly heat-resistant epoxy resin.As a result,this alloy film is clarified to have both the high resin flow and superior reflow-crack resistance.