Methods and tools for generating measurement models of complex device structures based on reusable parametric models are presented. Metrology systems employing these models are configured to measure structural and material properties associated with different semiconductor manufacturing processes. The reusable parametric sub-structure model is fully defined by a set of independent parameters entered by the user of the model building tool. All other variables associated with the internal constraints between model geometry and constituent geometric elements are predefined in the model. In some embodiments, one or more reusable parametric models are integrated into a measurement model of a complex semiconductor device. In another aspect, the model building tool generates a reusable parametric sub-structure model based on input from a user. The final model may be exported to a file that can be used by other users and may include security features for controlling the sharing of sensitive intellectual property rights with a particular user.
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