300MM POLISHED SILICON WAFER MANUFACTURING PROCESS BY HIGH TEMPERATURE HEAT TREATMENT

摘要

the present invention the bar to provide a 300mm polished silicon wafer manufacturing process using a high temperature heat treatment, including crystal pulling, slice chamfering, double-sided grinding, double-sided polishing, a final polishing, a high temperature treatment process do. Microscopic damage in the manufacturing process of the present invention are not removed from the hold-sided grinding, and skip the cross-section grinding process by proceeding directly to the polishing after the grinding, and the grinding surface and removed in a subsequent high-temperature heat treatment step, the present process is the process as well as to simple and improving the production efficiency can improve the quality of the silicon wafer. ;