LED CERAMIC PACKAGING HEAT DISSAPATION STRUCTURE AND METHOD OF MANUFACTURING THE SAME AND LIGHT EMITTING DIODE HEAT DISSAPATION PACKAGE

摘要

improve the conduction of heat by the ability to discharge to the outside structured to have the thermal transfer, thermal radiation, durability, and wear resistance, ceramic packaging heat radiating structure that can release heat to the outside air cooling system and discloses a method of manufacturing the same and, LED packages having the same radiation. Ceramic packaging heat radiation structure according to the present invention is a ceramic substrate having a non-active area placed on the outer side of the LED chip mounting area and the LED chip mounting area; A plurality of nano-pores that are formed so as to penetrate the LED chip mounting area and the non-active areas of the ceramic substrate, respectively, the air is passed into the interior; And is optionally embedded in a portion of the plurality of nanopores, buried metal filled within the ceramic substrate, characterized in that the containing ;