WATER POLISHING COMPOSITION AND METHOD OF CHEMICAL-MECHANICAL POLISHING OF SUBSTRATE MATERIALS FOR ELECTRIC, MECHANICAL AND OPTICAL DEVICES

摘要

FIELD: chemistry.SUBSTANCE: invention is aimed at water polishing composition, which is especially suitable for polishing substrate materials for electric, mechanical and optical devices. Composition contains (A) abrasive particles, which are positively charged, when dispersed in water medium, which has pH in the interval from 3 to 9; (B) water-soluble or water-dispersible components, selected from (b1) aliphatic and cycloaliphatic oxicarboxylic acids, where molar ratio of hydroxyl groups to groups of carboxylic acids constitutes at least 2; (b2) esters or lactones of oxicarbolxylic acids (b1), which have at least two hydroxyl groups; and (b3) their mixtures; and (C) water-soluble or water-dispersible polymer components, selected from (c1) linear and branched polymers of alkylenoxides; (c2) linear and branched, aliphatic and cycloaliphatic poly(N-vinylamide) polymers; and (c3) cationic polymer flocculants, which have weight average molecular weight less than 100000 Dalton.EFFECT: composition demonstrates improved oxide/nitride selectivity and ensures obtaining polished plates, which have good global and local flatness.13 cl, 6 tbl, 6 ex