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Effects of mechanical characteristics on the chemical-mechanical polishing of dielectric thin films

机译：机械特性对介电薄膜化学机械抛光的影响

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Wei-tsu Tseng A; Chi-wen Liu B; Bau-tong Dai; Ching-fa Yeh;
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机译：铜化学机械抛光中介电腐蚀和铜凹陷的模拟

Effects of mechanical characteristics on the chemical-mechanical polishing of dielectric thin films

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