Apparatus and method for embedding components in Small Form Factor System-on-Packages

摘要

In accordance with various aspects of the present disclosure, devices and methods are disclosed that include a communication platform that includes a small form factor platform having a system-on-package architecture. The system-on-package architecture may be arranged as a stack of layers, comprising: a first layer of the stack of layers comprising a first conformable material; a second layer of the stack of layers comprising a second conformable material; a third layer of the stack of layers comprising a third material, wherein the first conformable material and the second conformable material are more flexible than the third material; and one or more electronic components embedded in the stack of layers, wherein the one or more electronic components are configured to process a received wireless signal.