Adhesive tape for semiconductor wafer processing, manufacturing method of adhesive tape for semiconductor wafer processing, and semiconductor wafer processing method

摘要

To provide a pressure-sensitive adhesive tape for semiconductor wafer processing which has good followability to the surface of a semiconductor wafer having steps and protrusions and which can be peeled off without peeling of the semiconductor wafer or adhesive residue during peeling, a method of manufacturing an adhesive tape for semiconductor wafer processing And a method of processing a semiconductor wafer. SOLUTION: This pressure-sensitive adhesive tape for semiconductor wafer processing has a pressure-sensitive adhesive layer on at least one side of a substrate film, wherein the pressure-sensitive adhesive of the pressure-sensitive adhesive layer contains at least the component (a), the component (b) (A) is a crosslinking agent, and said component (b) is a (meth) acrylic copolymer having a reactive functional group reactive with the crosslinking agent of said component (a) (C) is a compound having an ethylenically unsaturated group and a reactive functional group which reacts with the crosslinking agent of the component (a), and the gel fraction of the pressure sensitive adhesive is 30 To 80%, a method of manufacturing an adhesive tape for processing a semiconductor wafer, and a method of processing a semiconductor wafer. Selection drawing None