ADHESIVE TAPE FOR SEMICONDUCTOR WAFER PROCESSING, MANUFACTURING METHOD OF ADHESIVE TAPE FOR SEMICONDUCTOR WAFER PROCESSING, AND PROCESSING METHOD OF SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide an adhesive tape for semiconductor wafer processing that is good in followability to a semiconductor wafer surface having steps or projections and capable of being detached without breakage of a semiconductor wafer or adhesive residue during detachment, a manufacturing method of the adhesive tape for semiconductor wafer processing and a processing method of the semiconductor wafer.;SOLUTION: There is provided an adhesive tape for semiconductor wafer processing having an adhesive layer on at least one surface of a substrate film. An adhesive in the adhesive layer consists of at least a component (a), a component (b) and a component (c) respectively. The component (a) is a crosslinking agent, the component (b) is a (meth)acrylic copolymer having a reactive functional group which reacts with the crosslinking agent of the component (a) and the component (c) is a compound having an ethylenic unsaturated group and a reactive functional group which reacts with the crosslinking agent of the component (a). And gel fraction of the adhesive is 30 to 80%. There are also provided a manufacturing method of the adhesive tape for semiconductor wafer processing and a processing method for semiconductor wafer.;SELECTED DRAWING: None;COPYRIGHT: (C)2017,JPO&INPIT